Imaging apparatus and electronic equipment

ABSTRACT

The present disclosure relates to an imaging apparatus and electronic equipment that make it possible to reduce peeling stresses at angled sections included in the four corners of a lens, and prevent the lens from being peeled off. An imaging apparatus includes a solid-state imaging element that generates a pixel signal by photoelectric conversion according to a light amount of incident light, a glass substrate provided on the solid-state imaging element, and a lens provided on the glass substrate, in which four corners of the lens that is substantially rectangular when seen in a plan view do not have angles equal to or smaller than 90°. The present technology may be applied to an imaging apparatus and the like, for example.

TECHNICAL FIELD

The present disclosure relates to an imaging apparatus and electronicequipment, and in particular relates to an imaging apparatus andelectronic equipment that make it possible to reduce peeling stresses atangled sections included in four corners of a lens, and prevent the lensfrom being peeled off.

BACKGROUND ART

In recent years, solid-state imaging elements used in mobile terminalapparatuses with a camera, digital still cameras, or the like have anincreasingly larger number of pixels, more reduced size, and smallerheight.

Along with an increase of the number of pixels and a size reduction ofcameras, typically, a distance between a lens and a solid-state imagingelement along their optical axes becomes shorter, and an infrared cutfilter is arranged near the lens.

For example, there is a proposed technology that realizes a sizereduction of a solid-state imaging element by configuring, on thesolid-state imaging element, the lowermost-layer lens in a lens groupincluding a plurality of lenses.

CITATION LIST Patent Literature

-   [PTL 1]    -   Japanese Patent Laid-open No. 2015-061193

SUMMARY Technical Problem

However, in a case where the lowermost-layer lens is configured on thesolid-state imaging element, contraction stresses are concentrated atangled sections included in the four corners of a lens when seen in aplan view, and the lens in this state can easily be peeled off.

The present disclosure has been made in view of such a situation, and inparticular makes it possible to reduce peeling stresses of angledsections included in the four corners of a lens, and prevent the lensfrom being peeled off.

Solution to Problem

An imaging apparatus according to an aspect of the present disclosureincludes a solid-state imaging element that generates a pixel signal byphotoelectric conversion according to a light amount of incident light,a glass substrate provided on the solid-state imaging element, and alens provided on the glass substrate, in which four corners of the lensthat is substantially rectangular when seen in a plan view do not haveangles equal to or smaller than 90°.

Electronic equipment according to another aspect of the presentdisclosure includes an imaging apparatus including a solid-state imagingelement that generates a pixel signal by photoelectric conversionaccording to a light amount of incident light, a glass substrateprovided on the solid-state imaging element, and a lens provided on theglass substrate, in which four corners of the lens that is substantiallyrectangular when seen in a plan view do not have angles equal to orsmaller than 90°.

In an aspect of the present disclosure, a configuration includes asolid-state imaging element that generates a pixel signal byphotoelectric conversion according to a light amount of incident light,a glass substrate provided on the solid-state imaging element, and alens provided on the glass substrate. Four corners of the lens that issubstantially rectangular when seen in a plan view do not have anglesequal to or smaller than 90°.

The imaging apparatus and the electronic equipment may be discreteapparatuses or may be modules to be incorporated into other apparatuses.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a figure for explaining a configuration example of a firstembodiment of an imaging apparatus according to the present disclosure.

FIG. 2 is an external appearance schematic view of an integratedconfiguration section including a solid-state imaging element in theimaging apparatus in FIG. 1 .

FIG. 3 depicts a figure for explaining a substrate configuration of theintegrated configuration section.

FIG. 4 is a figure depicting a circuit configuration example of astacked substrate.

FIG. 5 is a figure depicting an equivalent circuit of a pixel.

FIG. 6 is a figure depicting a specific structure of the stackedsubstrate.

FIG. 7 is a figure for explaining that ghosts and flares resulting frominternal diffused reflection do not occur in the imaging apparatus inFIG. 1 .

FIG. 8 is a figure for explaining that ghosts and flares resulting frominternal diffused reflection do not occur in an image captured by theimaging apparatus in FIG. 1 .

FIG. 9 is a figure for explaining a configuration example of a secondembodiment of the imaging apparatus according to the present disclosure.

FIG. 10 is a figure for explaining that ghosts and flares resulting frominternal diffused reflection do not occur in the imaging apparatus inFIG. 9 .

FIG. 11 is a figure for explaining a configuration example of a thirdembodiment of the imaging apparatus according to the present disclosure.

FIG. 12 is a figure for explaining a configuration example of a fourthembodiment of the imaging apparatus according to the present disclosure.

FIG. 13 is a figure for explaining a configuration example of a fifthembodiment of the imaging apparatus according to the present disclosure.

FIG. 14 is a figure for explaining a configuration example of a sixthembodiment of the imaging apparatus according to the present disclosure.

FIG. 15 is a figure for explaining a configuration example of a seventhembodiment of the imaging apparatus according to the present disclosure.

FIG. 16 is a figure for explaining a configuration example of an eighthembodiment of the imaging apparatus according to the present disclosure.

FIG. 17 is a figure for explaining a configuration example of a ninthembodiment of the imaging apparatus according to the present disclosure.

FIG. 18 is a figure for explaining a configuration example of a tenthembodiment of the imaging apparatus according to the present disclosure.

FIG. 19 is a figure for explaining a configuration example of aneleventh embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 20 is a figure for explaining a configuration example of a twelfthembodiment of the imaging apparatus according to the present disclosure.

FIG. 21 is a figure for explaining a configuration example of athirteenth embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 22 is a figure for explaining a configuration example of afourteenth embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 23 is a figure for explaining a configuration example of afifteenth embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 24 is a figure for explaining modification examples of an outlineshape of a lens in FIG. 23 .

FIG. 25 is a figure for explaining modification examples of thestructure of a lens end section in FIG. 23 .

FIG. 26 is a figure for explaining modification examples of thestructure of the lens end section in FIG. 23 .

FIG. 27 is a figure for explaining modification examples of thestructure of the lens end section in FIG. 23 .

FIG. 28 is a figure for explaining modification examples of thestructure of the lens end section in FIG. 23 .

FIG. 29 is a figure for explaining configuration examples of a sixteenthembodiment of the imaging apparatus according to the present disclosure.

FIG. 30 is a figure for explaining a method of manufacturing the imagingapparatus in FIG. 29 .

FIG. 31 is a figure for explaining modification examples of a dicingcross-section of the configuration example in FIG. 29 .

FIG. 32 is a figure for explaining a method of manufacturing the imagingapparatus related to an upper left portion in FIG. 31 .

FIG. 33 is a figure for explaining a method of manufacturing the imagingapparatus related to a lower left portion in FIG. 31 .

FIG. 34 is a figure for explaining a method of manufacturing the imagingapparatus related to an upper right portion in FIG. 31 .

FIG. 35 is a figure for explaining a method of manufacturing the imagingapparatus related to a lower right portion in FIG. 31 .

FIG. 36 is a figure for explaining modification examples in which ananti-reflection film is added to the configuration in FIG. 29 .

FIG. 37 is a figure for explaining modification examples in which ananti-reflection film is added to the side-surface section in theconfiguration in FIG. 29 .

FIG. 38 is a figure for explaining a configuration example of aseventeenth embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 39 is a figure for explaining conditions about a thickness of alens that is small-sized and lightweight, and capable of capturing ahigh-resolution image.

FIG. 40 is a figure for explaining the distributions of stresses appliedto an AR coat of the lens at the time of implementation reflow heat loadaccording to shapes of the lens.

FIG. 41 is a figure for explaining modification examples of the lensshape in FIG. 39 .

FIG. 42 is a figure for explaining the shape of a two-step side-surfacelens in FIG. 41 .

FIG. 43 is a figure for explaining modification examples of the shape ofthe two-step side-surface lens in FIG. 41 .

FIG. 44 is a figure for explaining the distributions of stresses appliedonto the AR coat on the two-step side-surface lens in FIG. 41 at thetime of implementation reflow heat load of the lens.

FIG. 45 is a figure for explaining the maximum values in thedistributions of stresses applied onto the AR coat on the lens at thetime of implementation reflow heat load in FIG. 44 .

FIG. 46 is a figure for explaining a manufacturing method in aneighteenth embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 47 is a figure for explaining modification examples of themanufacturing method in FIG. 46 .

FIG. 48 is a figure for explaining a method of manufacturing thetwo-step side-surface lens.

FIG. 49 is a figure for explaining a modification example of the methodof manufacturing the two-step side-surface lens.

FIG. 50 is a figure for explaining adjustments of angles formed by theaverage surfaces of side surfaces, adjustments of surface roughness, andprovision of a skirt section in the method of manufacturing the two-stepside-surface lens in FIG. 49 .

FIG. 51 is a figure for explaining a configuration example of anineteenth embodiment of the imaging apparatus according to the presentdisclosure.

FIG. 52 is a figure for explaining examples of an alignment mark in FIG.51 .

FIG. 53 is a figure for explaining an application example in which thealignment mark in FIG. 51 is used.

FIG. 54 is a figure for explaining configuration examples of a twentiethembodiment of the imaging apparatus according to the present disclosure.

FIG. 55 is a figure for explaining the distributions of stresses appliedonto AR coats at the time of implementation reflow heat load in a casewhere an AR coat is formed over the entire surface and in other cases.

FIG. 56 is a figure for explaining configuration examples of atwenty-first embodiment of the imaging apparatus according to thepresent disclosure.

FIG. 57 is a figure for explaining examples in which a light blockingfilm is formed on the side surface by configuring the lens and a banksuch that the lens and the bank are connected.

FIG. 58 is a figure for explaining configuration examples of atwenty-second embodiment of the imaging apparatus according to thepresent disclosure.

FIG. 59 is a figure for explaining principles of generation of bubblesif the entire outer circumferential section of a lens has a multi-stepconfiguration.

FIG. 60 is a figure for explaining a configuration example of the shapeof the lens in FIG. 58 and a shaping mold.

FIG. 61 is a figure for explaining advantages that are attained in acase where part of the outer circumferential section of the lens has anon-multi-step configuration section formed thereon.

FIG. 62 is a figure for explaining advantages that are attained in acase where part of the outer circumferential section of the lens has anon-multi-step configuration section formed thereon.

FIG. 63 is a figure for explaining advantages according to widths of thenon-multi-step configuration section in the outer circumferentialdirection of the lens.

FIG. 64 is a figure for explaining an application example of thetwenty-second embodiment of the imaging apparatus according to thepresent disclosure.

FIG. 65 is a figure for explaining an application example of thetwenty-second embodiment of the imaging apparatus according to thepresent disclosure.

FIG. 66 is a figure for explaining an application example of thetwenty-second embodiment of the imaging apparatus according to thepresent disclosure.

FIG. 67 is a figure for explaining an application example of thetwenty-second embodiment of the imaging apparatus according to thepresent disclosure.

FIG. 68 is a figure for explaining a twenty-third embodiment of theimaging apparatus according to the present disclosure.

FIG. 69 is a figure depicting a relation between radii of angledsections of the four corners of a lens and peeling stresses applied tothe angled sections.

FIG. 70 depicts a figure for explaining a method of forming angledsections of the four corners of a lens in arc shapes.

FIG. 71 is a figure depicting an example of the radii of angled sectionsof the four corners of a lens.

FIG. 72 is a figure depicting an example in which angled sections of thefour corners of a lens include polygonal shapes.

FIG. 73 is a figure depicting an example in which angled sections of thefour corners of a lens include polygonal shapes.

FIG. 74 is a block diagram depicting a configuration example of animaging apparatus as electronic equipment to which a camera moduleaccording to the present disclosure is applied.

FIG. 75 is a figure for explaining a use example of the camera module towhich the technology of the present disclosure is applied.

FIG. 76 is a view depicting an example of a schematic configuration ofan endoscopic surgery system.

FIG. 77 is a block diagram depicting an example of a functionalconfiguration of a camera head and a camera control unit (CCU).

FIG. 78 is a block diagram depicting an example of schematicconfiguration of a vehicle control system.

FIG. 79 is a diagram of assistance in explaining an example ofinstallation positions of an outside-vehicle information detectingsection and an image pickup unit.

DESCRIPTION OF EMBODIMENTS

Suitable embodiments according to the present disclosure are explainedin detail below with reference to the attached figures. Note thatoverlapping explanations about constituent elements having substantiallyidentical functional configurations in the present specification andfigures are omitted by giving the constituent elements identicalreference signs.

Modes for implementing the present disclosure (referred to asembodiments below) are explained below. Note that the explanations aregiven in the following order.

-   -   1. First Embodiment    -   2. Second Embodiment    -   3. Third Embodiment    -   4. Fourth Embodiment    -   5. Fifth Embodiment    -   6. Sixth Embodiment    -   7. Seventh Embodiment    -   8. Eighth Embodiment    -   9. Ninth Embodiment    -   10. Tenth Embodiment    -   11. Eleventh Embodiment    -   12. Twelfth Embodiment    -   13. Thirteenth Embodiment    -   14. Fourteenth Embodiment    -   15. Fifteenth Embodiment    -   16. Sixteenth Embodiment    -   17. Seventeenth Embodiment    -   18. Eighteenth Embodiment    -   19. Nineteenth Embodiment    -   20. Twentieth Embodiment    -   21. Twenty-First Embodiment    -   22. Twenty-Second Embodiment    -   23. Twenty-Third Embodiment    -   24. Examples of Application to Electronic Equipment    -   25. Use Examples of Solid-State Imaging Apparatus    -   26. Examples of Application to Endoscopic Surgery Systems    -   27. Examples of Application to Mobile Bodies

1. First Embodiment Configuration Examples of Imaging Apparatus

With reference to FIG. 1 , a configuration example of an imagingapparatus according to a first embodiment of the present disclosure thatreduces occurrence of ghosts and flares while realizing a size reductionand a height reduction of the apparatus configuration is explained. Notethat FIG. 1 is a side-surface cross-sectional view of the imagingapparatus.

An imaging apparatus 1 in FIG. 1 includes a solid-state imaging element11, a glass substrate 12, an IRCF (infrared cut filter) 14, a lens group16, a circuit board 17, an actuator 18, a connector 19, and a spacer 20.

The solid-state imaging element 11 is an image sensor including agenerally-called CMOS (Complementary Metal Oxide Semiconductor), CCD(Charge Coupled Device), or the like, and is fixed onto the circuitboard 17 in an electrically connected state. As mentioned later withreference to FIG. 4 , the solid-state imaging element 11 includes aplurality of pixels arranged in an array. Each of the pixels generates apixel signal according to the light amount of incident light that iscondensed and caused to enter via the lens group 16 from above in thefigure, and outputs the pixel signal as an image signal to the outsidefrom the connector 19 via the circuit board 17.

The glass substrate 12 is provided on the top surface section, in FIG. 1, of the solid-state imaging element 11, and the glass substrate 12 andthe solid-state imaging element 11 are pasted together by using anadhesive (GLUE) 13 that is transparent, that is, has a refractive indexwhich is substantially identical to the refractive index of the glasssubstrate 12.

The IRCF 14 that cuts infrared light in incident light is provided onthe top surface section, in FIG. 1 , of the glass substrate 12, and theIRCF 14 and the glass substrate 12 are pasted together by using anadhesive (GLUE) 15 that is transparent, that is, has a refractive indexwhich is substantially identical to the refractive index of the glasssubstrate 12. The IRCF 14 includes a blue plate glass, for example, andcuts (eliminates) infrared light.

That is, the solid-state imaging element 11, the glass substrate 12, andthe IRCF 14 are stacked on one another, and pasted together by using thetransparent adhesives 13 and 15 to have an integrated configurationwhich is connected to the circuit board 17. Note that because thesolid-state imaging element 11, the glass substrate 12, and the IRCF 14surrounded by a dash-dotted line in the figure are pasted together byusing the adhesives 13 and 15 having substantially identical refractiveindexes to have an integrated configuration, the solid-state imagingelement 11, the glass substrate 12, and the IRCF 14 are simply referredto also as an integrated configuration section 10 in explanations below.

In addition, the IRCF 14 may be pasted onto the glass substrate 12 afterthe solid-state imaging element 11 is diced at a step of manufacturingthe solid-state imaging element 11 or may be formed by being diced intoa piece for each solid-state imaging element 11 after a large-sized IRCF14 is pasted onto the entire glass substrate 12 in a wafer shapeincluding a plurality of solid-state imaging elements 11. Any of thesetechniques may be adopted.

The spacer 20 is configured on the circuit board 17 such that the spacer20 surrounds the whole including the integrally-configured solid-stateimaging element 11, the glass substrate 12, and the IRCF 14. Inaddition, the actuator 18 is provided on the spacer 20. The actuator 18has a cylindrical shape. The actuator 18 has therein the lens group 16including a plurality of lenses that are stacked on one another insidethe cylindrical shape, and drives the lens group 16 vertically in FIG. 1.

According to such a configuration, the actuator 18 realizes autofocusing by moving the lens group 16 vertically in FIG. 1 (in theforward/backward direction of the optical axis) to thereby adjust thefocal point such that an image of a subject which is not depicted, butis located in the upward direction in the figure is formed on theimaging surface of the solid-state imaging element 11 according to thedistance to the subject.

<External Appearance Schematic View>

Next, the configuration of the integrated configuration section 10 isexplained with reference to FIGS. 2 to 6 . FIG. 2 depicts an externalappearance schematic view of the integrated configuration section 10.

The integrated configuration section 10 depicted in FIG. 2 is asemiconductor package obtained by packaging the solid-state imagingelement 11 including a stacked substrate including a lower substrate 11a and an upper substrate lib that are stacked on one another.

A plurality of solder balls 11 e which are backside electrodes forelectrical connection with the circuit board 17 in FIG. 1 are formed onthe lower substrate 11 a of the stacked substrate included in thesolid-state imaging element 11.

R (red), G (green), and B (blue) color filters 11 c and on-chip lenses11 d are formed on the top surface of the upper substrate lib. Inaddition, the upper substrate lib is connected with the glass substrate12 for protecting the on-chip lenses 11 d by a cavity-less structure viathe adhesive 13 including a glass sealing resin.

For example, as depicted in A in FIG. 3 , a pixel region 21 having pixelsections that perform photoelectric conversion, and are arrayedtwo-dimensionally, and a control circuit 22 that controls the pixelsections are formed on the upper substrate lib, and a logic circuit 23such as a signal processing circuit that processes pixel signals outputfrom the pixel sections is formed on the lower substrate 11 a.

Alternatively, as depicted in B in FIG. 3 , in another possibleconfiguration, only the pixel region 21 may be formed on the uppersubstrate lib, and the control circuit 22 and the logic circuit 23 maybe formed on the lower substrate 11 a.

By forming the logic circuit 23 or both the control circuit 22 and thelogic circuit 23 on the lower substrate 11 a different from the uppersubstrate lib on which the pixel region 21 is formed as mentioned above,and stacking the lower substrate 11 a and the upper substrate 11 b oneon another, the size of the imaging apparatus 1 can be reduced ascompared with a case that the pixel region 21, the control circuit 22,and the logic circuit 23 are arranged in the plane direction on onesemiconductor substrate.

In explanations below, the upper substrate 11 b on which at least thepixel region 21 is formed is referred to as a pixel sensor substrate 11b, and the lower substrate 11 a on which at least the logic circuit 23is formed is referred to as a logic board 11 a.

Configuration Examples of Stacked Substrate

FIG. 4 depicts a circuit configuration example of the solid-stateimaging element 11.

The solid-state imaging element 11 includes a pixel array section 33having pixels 32 that are arrayed two-dimensionally, a vertical drivecircuit 34, column signal processing circuits 35, a horizontal drivecircuit 36, an output circuit 37, a control circuit 38, and aninput/output terminal 39.

A pixel 32 has a photodiode as a photoelectric converting element and aplurality of pixel transistors. A circuit configuration example of thepixels 32 is mentioned later with reference to FIG. 5 .

In addition, the pixels 32 can also have a shared pixel structure. Thepixel shared structure includes a plurality of photodiodes, a pluralityof transfer transistors, one shared floating diffusion (floatingdiffusion region), and other shared pixel transistors each type of whichis present singly. That is, in the shared pixels, the photodiodes andthe transfer transistors included in a plurality of unit pixels areconfigured to share the other pixel transistors each type of which ispresent singly.

The control circuit 38 receives input clocks and data as commands aboutoperation modes or the like, and outputs data of inside information ofthe solid-state imaging element 11 and the like. That is, on the basisof vertical synchronizing signals, horizontal synchronization signals,and master clocks, the control circuit 38 generates clock signals andcontrol signals which serve as reference signals for operation of thevertical drive circuit 34, the column signal processing circuits 35, thehorizontal drive circuit 36, and the like. Then, the control circuit 38outputs the generated clock signals and control signals to the verticaldrive circuit 34, the column signal processing circuits 35, thehorizontal drive circuit 36, and the like.

For example, the vertical drive circuit 34 includes a shift register,selects a predetermined pixel driving wire 40, supplies pulses fordriving pixels 32 to the selected pixel driving wire 40, and drivespixels 32 one row after another row. That is, the vertical drive circuit34 selects and scans the pixels 32 in the pixel array section 33sequentially in the vertical direction one row after another row, andsupplies, through vertical signal lines 41, the column signal processingcircuits 35 with pixel signals based on signal charge generatedaccording to received light amounts at the photoelectric convertingsections of the pixels 32.

Each column signal processing circuit 35 is arranged corresponding to acolumn of pixels 32, and performs signal processing such as noiseelimination on a signal output from a pixel 32 in one line and in thecorresponding pixel column. For example, the column signal processingcircuits 5 perform signal processing such as CDS (Correlated DoubleSampling) for eliminating fixed pattern noise unique to the pixels or ADconversion.

For example, the horizontal drive circuit 36 includes a shift register,and outputs horizontal scanning pulses sequentially to thereby selecteach of the column signal processing circuits 35 one after another, andcauses a pixel signal to be output from each of the column signalprocessing circuits 35 to a horizontal signal line 42.

The output circuit 37 performs signal processing on signals suppliedsequentially from each of the column signal processing circuits 35through the horizontal signal line 42, and outputs the signals. Forexample, the output circuit 37 performs only buffering in some cases,and performs black level adjustment, column variation correction,various types of digital signal processing, and the like in some othercases. The input/output terminal 39 exchanges signals with the outside.

The thus-configured solid-state imaging element 11 is a CMOS imagesensor called a column AD CMOS image sensor having a column signalprocessing circuit 35 that performs a CDS process and an AD conversionprocess, and is arranged for each pixel column.

Circuit Configuration Examples of Pixels

FIG. 5 depicts an equivalent circuit of a pixel 32.

The pixel 32 depicted in FIG. 5 has a configuration that realizes anelectronic global shutter function.

The pixel 32 has a photodiode 51 as a photoelectric converting element,a first transfer transistor 52, a memory section (MEM) 53, a secondtransfer transistor 54, an FD (floating diffusion region) 55, a resettransistor 56, an amplification transistor 57, a selection transistor58, and a discharge transistor 59.

The photodiode 51 is a photoelectric converting section that generateselectric charge (signal charge) according to a received light amount,and accumulates the electric charge. The photodiode 51 has an anodeterminal which is grounded, and also a cathode terminal which isconnected to the memory section 53 via the first transfer transistor 52.In addition, the cathode terminal of the photodiode 51 is connected alsowith the discharge transistor 59 for discharging unnecessary electriccharge.

When the first transfer transistor 52 is turned on according to atransfer signal TRX, the first transfer transistor 52 reads out electriccharge generated at the photodiode 51, and transfers the electric chargeto the memory section 53. The memory section 53 is a charge retainingsection that retains electric charge temporarily until the electriccharge is transferred to the FD 55.

When the second transfer transistor 54 is turned on according to atransfer signal TRG, the second transfer transistor 54 reads outelectric charge retained at the memory section 53, and transfers theelectric charge to the FD 55.

The FD 55 is a charge retaining section that retains electric chargeread out from the memory section 53 in order to read out the electriccharge as a signal. When the reset transistor 56 is turned on accordingto a reset signal RST, the reset transistor 56 resets the potential ofthe FD 55 by discharging electric charge accumulated in the FD 55 to aconstant voltage source VDD.

The amplification transistor 57 outputs a pixel signal according to thepotential of the FD 55. That is, the amplification transistor 57 isincluded in a source follower circuit together with a load MOS 60 as aconstant current source, and a pixel signal representing a levelaccording to electric charge accumulated in the FD 55 is output from theamplification transistor 57 to the column signal processing circuit 35(FIG. 4 ) via the selection transistor 58. The load MOS 60 is arrangedin the column signal processing circuit 35, for example.

The selection transistor 58 is turned on when the pixel 32 is selectedaccording to a selection signal SEL, and outputs a pixel signal of thepixel 32 to the column signal processing circuit 35 via the verticalsignal line 41.

When the discharge transistor 59 is turned on according to a dischargesignal OFG, the discharge transistor 59 discharges unnecessary electriccharge accumulated in the photodiode 51 to the constant voltage sourceVDD.

The transfer signals TRX and TRG, the reset signal RST, the dischargesignal OFG, and the selection signal SEL are supplied from the verticaldrive circuit 34 via the pixel driving wire 40.

Operation of the pixels 32 is explained simply.

First, before the start of exposure, the discharge signal OFG at Highlevel is supplied to the discharge transistors 59. Thereby, thedischarge transistors 59 are turned on, electric charge accumulated inthe photodiodes 51 is discharged to the constant voltage source VDD, andthe photodiodes 51 of all the pixels are reset.

When the discharge transistors 59 are turned off according to thedischarge signal OFG at Low level after the photodiodes 51 are reset,exposure is started in all the pixels in the pixel array section 33.

After an elapse of predetermined exposure time that has been determinedin advance, the first transfer transistors 52 are turned on according tothe transfer signal TRX in all the pixels in the pixel array section 33,and electric charge accumulated in the photodiodes 51 is transferred tothe memory sections 53.

After the first transfer transistors 52 are turned off, the electriccharge retained at the memory sections 53 of the pixels 32 is read outby the column signal processing circuits 35 sequentially one row afteranother row. In the read operation, the second transfer transistors 54of pixels 32 in a row being read are turned on according to the transfersignal TRG, and the electric charge retained at the memory sections 53is transferred to the FDs 55. Then, the selection transistors 58 areturned on according to the selection signal SEL. Thereby, signalsrepresenting levels according to the electric charge accumulated in theFDs 55 are output from the amplification transistors 57 to the columnsignal processing circuits 35 via the selection transistors 58.

As mentioned above, the pixels 32 having the pixel circuit in FIG. 5 arecapable of global shutter operation (imaging) in which identicalexposure time is set for all the pixels in the pixel array section 33,electric charge is temporarily retained in the memory sections 53 afterthe end of exposure, and the electric charge is read out from the memorysections 53 sequentially one row after another row.

Note that the circuit configuration of the pixels 32 is not limited tothe configuration depicted in FIG. 5 , and, for example, a circuitconfiguration that does not have a memory section 53 but performsgenerally-called rolling shutter operation can also be adopted.

Basic Structure Examples of Solid-State Imaging Apparatus

Next, the specific structure of the solid-state imaging element 11 isexplained with reference to FIG. 6 . FIG. 6 is a cross-sectional viewdepicting an enlarged view of a portion of the solid-state imagingelement 11.

In the logic board 11 a, a multilayer wiring layer 82 is formed on theupper side (the pixel-sensor-substrate-11 b side) of a semiconductorsubstrate 81 (referred to as a silicon substrate 81 below) includingsilicon (Si), for example. The control circuit 22 and the logic circuit23 in FIG. 3 are configured by the multilayer wiring layer 82.

The multilayer wiring layer 82 includes a plurality of wiring layers 83including an uppermost wiring layer 83 a closest to the pixel sensorsubstrate 11 b, a middle wiring layer 83 b, a lowermost wiring layer 83c closest to the silicon substrate 81, and the like, and interlayerdielectric films 84 formed between the wiring layers 83.

The plurality of wiring layers 83 are formed by using copper (Cu),aluminum (Al), tungsten (W), or the like, for example, and theinterlayer dielectric films 84 include a silicon oxide film, a siliconnitride film, or the like, for example. All layers in each of theplurality of wiring layers 83 and the interlayer dielectric films 84 mayinclude an identical material or may include two or more materials thatare used differently between layers.

A silicon through hole 85 that penetrates the silicon substrate 81 isformed at a predetermined position of the silicon substrate 81. Aconnection conductor 87 is embedded via an insulating film 86 on theinner wall of the silicon through hole 85, and thereby a through siliconvia (TSV) 88 is formed. The insulating film 86 can include an SiO2 film,an SiN film, or the like, for example.

Note that whereas the insulating film 86 and the connection conductor 87are formed along the inner wall surface, and the inside of the siliconthrough hole 85 is a cavity in the through silicon via 88 depicted inFIG. 6 , the whole of the inside of the silicon through hole 85 isfilled with the connection conductor 87 in some cases depending on theinternal diameter. Stated differently, it does not matter whether theinside of the through hole is filled with the conductor or part of theinside of the through hole is a cavity. The same is true also of athrough chip via (TCV: Through Chip Via) 105 or the like mentionedlater.

The connection conductor 87 of the through silicon via 88 is connectedwith a rewire 90 formed on the lower-surface side of the siliconsubstrate 81, and the rewire 90 is connected with a solder ball 11 e.The connection conductor 87 and the rewire 90 can include copper (Cu),tungsten (W), tungsten (W), polysilicon, or the like, for example.

In addition, a solder mask (solder resist) 91 is formed to cover therewire 90 and the insulating film 86 on the lower-surface side of thesilicon substrate 81, except for a region where the solder ball 11 e isformed.

On the other hand, in the pixel sensor substrate 11 b, a multilayerwiring layer 102 is formed on the lower side (logic-board-11 a side) ofa semiconductor substrate 101 (referred to as a silicon substrate 101below) including silicon (Si). The pixel circuits of the pixel region 21in FIG. 3 are configured by the multilayer wiring layer 102.

The multilayer wiring layer 102 includes a plurality of wiring layers103 including an uppermost wiring layer 103 a closest to the siliconsubstrate 101, a middle wiring layer 103 b, a lowermost wiring layer 103c closest to the logic board 11 a, and the like, and interlayerdielectric films 104 formed between the wiring layers 103.

The same types of material as the materials of the wiring layers 83 andthe interlayer dielectric films 84 mentioned above can be adopted asmaterials to be used as the plurality of wiring layers 103 and theinterlayer dielectric films 104. In addition, the plurality of wiringlayers 103 and the interlayer dielectric films 104 are similar to thewiring layers 83 and the interlayer dielectric films 84 mentioned abovein that one or two or more materials may be included and useddifferently.

Note that whereas the multilayer wiring layer 102 of the pixel sensorsubstrate 11 b includes the wiring layers 103 including three layers,and the multilayer wiring layer 82 of the logic board 11 a includes thewiring layers 83 including four layers in the example in FIG. 6 , thetotal numbers of wiring layers are not limited to these, and any numbersof layers can be included in the multilayer wiring layer 102 of thepixel sensor substrate 11 b and the multilayer wiring layer 82 of thelogic board 11 a.

In the silicon substrate 101, a photodiode 51 formed by a PN junction isformed for each pixel 32.

In addition, although not depicted, but omitted, the multilayer wiringlayer 102 and the silicon substrate 101 have a plurality of pixeltransistors such as the first transfer transistors 52 or the secondtransfer transistor 54, the memory sections (MEM) 53, and the like thatare formed therein.

A through silicon via 109 connected with the wiring layer 103 a of thepixel sensor substrate lib, and the through chip via 105 connected withthe wiring layer 83 a of the logic board 11 a are formed atpredetermined positions of the silicon substrate 101 where the colorfilters 11 c and the on-chip lenses 11 d are not formed.

The through chip via 105 and the through silicon via 109 are connectedby a connection wire 106 formed on the top surface of the siliconsubstrate 101. In addition, an insulating film 107 is formed between thesilicon substrate 101 and each of the through silicon via 109 and thethrough chip via 105. Furthermore, the color filters 11 c and theon-chip lenses 11 d are formed on the top surface of the siliconsubstrate 101 via a flattening film (insulating film) 108.

As mentioned above, the solid-state imaging element 11 depicted in FIG.2 has a stacked structure formed by pasting together themultilayer-wiring-layer-102 side of the logic board 11 a and themultilayer-wiring-layer-82 side of the pixel sensor substrate lib. InFIG. 6 , surfaces on which the multilayer-wiring-layer-102 side of thelogic board 11 a and the multilayer-wiring-layer-82 side of the pixelsensor substrate lib are pasted together are represented by a brokenline.

In addition, in the solid-state imaging element 11 of the imagingapparatus 1, the wiring layers 103 of the pixel sensor substrate lib andthe wiring layers 83 of the logic board 11 a are connected by twothrough vias which are the through silicon via 109 and the through chipvia 105, and the wiring layers 83 of the logic board 11 a and the solderball (backside electrode) 11 e are connected by the through silicon via88 and the rewire 90. Thereby, the planar area size of the imagingapparatus 1 can be reduced to the utmost.

Furthermore, by adopting a cavity-less structure between the solid-stateimaging element 11 and the glass substrate 12, and pasting together thesolid-state imaging element 11 and the glass substrate 12 by using theadhesive 13, the height can also be reduced.

Accordingly, according to the imaging apparatus 1 depicted in FIG. 1 , asemiconductor apparatus (semiconductor package) having a smaller sizecan be realized.

According to the configuration of the imaging apparatus 1 like the oneabove, the IRCF 14 is provided on the solid-state imaging element 11 andthe glass substrate 12, and accordingly it becomes possible to reduceoccurrence of flares and ghosts due to internal diffused reflection oflight.

That is, in a case where the IRCF 14 is configured to be spaced apartfrom the glass substrate (Glass) 12, and near a middle portion betweenthe lens (Lens) 16 and the glass substrate 12 as depicted in the leftportion in FIG. 7 , incident light is condensed as represented by solidlines, enters the solid-state imaging element (CIS) 11 at a position F0via the IRCF 14, the glass substrate 12, and the adhesive 13, and thenis reflected at a the position F0, and generates reflection light asrepresented by dotted lines.

As represented by the dotted lines, for example, part of the reflectionlight reflected at the position F0 is reflected off of a backside (thesurface on the lower side in FIG. 7 ) R1 of the IRCF 14 arranged at theposition spaced apart from the glass substrate 12 via the adhesive 13and the glass substrate 12, and enters again the solid-state imagingelement 11 at a position F1 again via the glass substrate 12 and theadhesive 13.

In addition, as represented by the dotted lines, for example, other partof the reflection light reflected at the focal point F0 is transmittedthrough the adhesive 13 and the glass substrate 12, and the IRCF 14arranged at the position spaced apart from the glass substrate 12, isreflected off of a top surface (the surface on the upper side in FIG. 7) R2 of the IRCF 14, and enters again the solid-state imaging element 11at a position F2 via the IRCF 14, the glass substrate 12, and theadhesive 13.

The light that enters again at the positions F1 and F2 generates flaresand ghosts resulting from internal diffused reflection. Morespecifically, as depicted in an image P1 in FIG. 8 , when illumination Lis captured as an image in the solid-state imaging element 11, theillumination L appears as flares and ghosts as represented by reflectionlight R21 and R22.

In contrast to this, if the IRCF 14 is configured on the glass substrate12 as in the imaging apparatus 1 as depicted in the right portion inFIG. 7 corresponding to the configuration of the imaging apparatus 1 inFIG. 1 , incident light represented by solid lines is condensed, entersthe solid-state imaging element 11 at the position F0 via the IRCF 14,the adhesive 15, the glass substrate 12, and the adhesive 13, and thenis reflected as represented by dotted lines. Then, the reflected lightis reflected off of a surface R11 of a lowermost-layer lens on the lensgroup 16 via the adhesive 13, the glass substrate 12, the adhesive 15,and the IRCF 14, but is reflected within such an area that thesolid-state imaging element 11 cannot receive the reflected lightsufficiently because the lens group 16 is at a position that issufficiently far from the IRCF 14.

Here, the solid-state imaging element 11, the glass substrate 12, andthe IRCF 14 surrounded by a dash-dotted line in the figure are pastedtogether and integrated by using the adhesives 13 and 15 havingsubstantially identical refractive indexes to be configured as theintegrated configuration section 10. Because the integratedconfiguration section 10 has substantially identical refractive indexes,occurrence of internal diffused reflection at the boundary of layershaving different refractive indexes is reduced, and, for example,occurrence of re-entrance at the positions F1 and F2 which are near theposition F0 in the left portion in FIG. 7 is reduced.

Thereby, in a case where the imaging apparatus 1 in FIG. 1 captures animage of the illumination L, the imaging apparatus 1 can capture animage in which occurrence of flares and ghosts resulting from internaldiffused reflection like the reflection light R21 and R22 in the imageP1 is reduced, as depicted in an image P2 in FIG. 8 .

As a result, according to the configuration like the imaging apparatus 1according to the first embodiment depicted in FIG. 1 , a size reductionand a height reduction of the apparatus configuration can be realized,and also occurrence of flares and ghosts resulting from internaldiffused reflection can be reduced.

Note that the image P1 in FIG. 8 is an image of the illumination Lcaptured at night by the imaging apparatus 1 including the configurationin the left portion in FIG. 7 , and the image P2 is an image of theillumination L captured at night by the imaging apparatus 1 (in FIG. 1 )including the configuration in the right portion in FIG. 7 .

In addition, whereas the configuration can realize auto focusing bymoving the lens group 16 vertically in FIG. 1 by using the actuator 18to thereby adjust the focal length according to the distance to asubject in the examples explained thus far, the actuator 18 may not beprovided, and the lens group 16 may be lenses that function as agenerally-called fixed focal length lens whose focal length cannot beadjusted.

2. Second Embodiment

Whereas the IRCF 14 is pasted onto the glass substrate 12 pasted on theimaging-surface side of the solid-state imaging element 11 in theexample explained in the first embodiment, furthermore, alowermost-layer lens included in the lens group 16 may be provided onthe IRCF 14.

FIG. 9 depicts a configuration example of the imaging apparatus 1 inwhich the lowermost-layer lens, in terms of the direction of incidenceof light, in the lens group 16 including a plurality of lenses includedin the imaging apparatus 1 in FIG. 1 is configured on the IRCF 14separately from the lens group 16. Note that configurations in FIG. 5that have functions basically identical to configurations in FIG. 1 aregiven identical reference signs, and explanations thereof are omitted asappropriate.

That is, the imaging apparatus 1 in FIG. 9 is different from the imagingapparatus 1 in FIG. 1 in that furthermore a lowermost-layer lens 131, interms of the direction of incidence of light, in the plurality of lensesincluded in the lens group 16 is further provided separately from thelens group 16 on the top surface of the IRCF 14 in the figure. Note thatthe lens group 16 in FIG. 9 is given the identical reference sign to thelens group 16 in FIG. 1 but is different from the lens group 16 in FIG.1 strictly in not including the lowermost-layer lens 131 in terms of thedirection of incidence of light.

According to the configuration of the imaging apparatus 1 as in FIG. 9 ,the IRCF 14 is provided on the glass substrate 12 provided on thesolid-state imaging element 11, and furthermore the lowermost-layer lens131 included in the lens group 16 is provided on the IRCF 14.Accordingly, it becomes possible to reduce occurrence of flares andghosts due to internal diffused reflection of light.

That is, in a case where the lowermost-layer lens 131, in terms of thedirection of incidence of light, of the lens group 16 is provided on theglass substrate 12, and the IRCF 14 is configured to be spaced apartfrom the lens 131 and near a middle portion between the lens group 16and the lens 131 as depicted in the left portion in FIG. 10 , incidentlight represented by solid lines is condensed, enters the solid-stateimaging element 11 at the position F0 via the IRCF 14, the lens 131, theglass substrate 12, and the adhesive 13, and then is reflected at theposition F0, and generates reflection light as represented by dottedlines.

As represented by the dotted lines, for example, part of the reflectionlight reflected at the position F0 is reflected off of a backside (thesurface on the lower side in FIG. 2 ) R31 of the IRCF 14 arranged at theposition spaced apart from the lens 131 via the adhesive 13, the glasssubstrate 12, and the lens 131, and enters again the solid-state imagingelement 11 at a position F11 via the lens 131, the glass substrate 12,and the adhesive 13.

In addition, as represented by the dotted lines, for example, other partof the reflection light reflected at the focal point F0 is transmittedthrough the adhesive 13, the glass substrate 12, and the lens 131, andthe IRCF 14 arranged at the position spaced apart from the lens 131, isreflected off of a top surface (the surface on the upper side in FIG. 7) R32 of the IRCF 14, and enters again the solid-state imaging element11 at a position F12 via the IRCF 14, the lens 131, the glass substrate12, and the adhesive 13.

The light that enters again at the positions F11 and F12 appear asflares and ghosts in the solid-state imaging element 11. In this regard,principles basically similar to the principles of generation of thereflection lights R21 of the illumination L in the image P1 explainedwith reference to FIG. 8 in a case where the reflection lights R21re-enters at the positions F1 and F2 in FIG. 7 apply.

In contrast to this, similarly to the configuration in the imagingapparatus 1 in FIG. 9 , if the lowermost-layer lens 131 in the lensgroup 16 is configured on the IRCF 14 as depicted in the right portionin FIG. 10 , incident light is condensed as represented by solid lines,enters the solid-state imaging element 11 at the position F0 via thelens 131, the IRCF 14, the adhesive 15, the glass substrate 12, and theadhesive 13, and then is reflected, and generates reflection light asrepresented by dotted lines due to a surface R41 on the lens group 16 ata position which is sufficiently far via the adhesive 13, the glasssubstrate 12, the adhesive 15, the IRCF 14, and the lens 131, butoccurrence of flares and ghosts can be reduced because the light isreflected within such an area that it is substantially impossible forthe solid-state imaging element 11 to receive the light.

That is, because the solid-state imaging element 11, the adhesive 13,the glass substrate 12, and the IRCF 14 have an integrated configurationobtained by being pasted together by using the adhesives 13 and 15having substantially identical refractive indexes, by havingsubstantially identical refractive indexes, the integrated configurationsection 10 which is the integrated configuration, and is surrounded by adash-dotted line in the figure reduces occurrence of internal diffusedreflection at the boundary between layers having different refractiveindexes, and reduces entrance of reflection light and the like to thepositions F11 and F12 near the position F0 as depicted in the leftportion in FIG. 10 , for example.

As a result, according to the configuration like the imaging apparatus 1according to the second embodiment depicted in FIG. 10 , a sizereduction and a height reduction of the apparatus configuration can berealized, and also occurrence of flares and ghosts resulting frominternal diffused reflection can be reduced.

3. Third Embodiment

Whereas the lowermost-layer lens 131 is provided on the IRCF 14 in theexample explained in the second embodiment, the lowermost-layer lens 131and the IRCF 14 may be pasted together by using an adhesive.

FIG. 11 depicts a configuration example of the imaging apparatus 1 inwhich the lowermost-layer lens 131 and the IRCF 14 are pasted togetherby using an adhesive. Note that configurations of the imaging apparatus1 in FIG. 11 that have functions identical to configurations of theimaging apparatus 1 in FIG. 9 are given identical reference signs, andexplanations thereof are omitted as appropriate.

That is, the imaging apparatus 1 in FIG. 11 is different from theimaging apparatus 1 in FIG. 9 in that the lowermost-layer lens 131 andthe IRCF 14 are pasted together by using an adhesive 151 that istransparent, that is, has a substantially identical refractive index.

In the configuration like the imaging apparatus 1 in FIG. 11 also, itbecomes possible to reduce occurrence of flares and ghosts similarly tothe imaging apparatus 1 in FIG. 9 .

In addition, in a case where the flatness of the lens 131 is not high,there is a fear that the IRCF 14 is misaligned with the optical axis ofthe lens 131 even if it is attempted to fix the lens 131 to the IRCF 14without using the adhesive 151, however, by pasting together the lens131 and the IRCF 14 by using the adhesive 151, it becomes possible tofix the lens 131 to the IRCF 14 such that the IRCF 14 is not misalignedwith the optical axis of the lens 131 even if the flatness of the lens131 is not high, and it becomes possible to reduce generation ofdistortions of an image that are caused by the misalignment of theoptical axes.

4. Fourth Embodiment

Whereas the lowermost-layer lens 131 in terms of the direction ofincidence of light is provided on the IRCF 14 in the example explainedin the second embodiment, not only the lowermost-layer lens 131, butalso a plurality of lens groups included in the lowermost layers of thelens group 16 may be provided on the IRCF 14.

FIG. 12 depicts a configuration example of the imaging apparatus 1 inwhich a lens group including a plurality of lenses included in thelowermost layers, in terms of the direction of incidence, in the lensgroup 16 is configured on the IRCF 14. Note that configurations of theimaging apparatus 1 in FIG. 12 that have functions identical toconfigurations of the imaging apparatus 1 in FIG. 9 are given identicalreference signs, and explanations thereof are omitted as appropriate.

That is, the imaging apparatus 1 in FIG. 12 is different from theimaging apparatus 1 in FIG. 9 in that, instead of the lens 131, a lensgroup 171 including a plurality of lenses included in the lowermostlayers, in terms of the direction of incidence of light, in the lensgroup 16 is provided on the IRCF 14. Note that whereas FIG. 12 depictsan example about the lens group 171 including two lenses, the lens group171 may include a larger number of lenses.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

In addition, because the lens group 171 including the plurality oflenses included in the lowermost layers in the plurality of lensesincluded in the lens group 16 is configured on the IRCF 14, the numberof lenses included in the lens group 16 can be reduced, and the weightof the lens group 16 can be reduced. Accordingly, it becomes possible toreduce the driving force amount of the actuator 18 used for autofocusing, and it becomes possible to realize a size reduction and anelectrical power reduction of the actuator 18.

Note that instead of the lens group 171, the lens 131 in the imagingapparatus 1 in FIG. 11 according to the third embodiment may be pastedonto the IRCF 14 by using the transparent adhesive 151.

5. Fifth Embodiment

Whereas the glass substrate 12 is pasted onto the solid-state imagingelement 11 by using the adhesive 13, and the IRCF 14 is pasted onto theglass substrate 12 by using the adhesive 15 in the example explained inthe second embodiment, the glass substrate 12, the adhesive 15, and theIRCF 14 may be replaced with a configuration having combined functionsincluding the function of the glass substrate 12 and the function of theIRCF 14, and the configuration may be pasted onto the solid-stateimaging element 11 by using the adhesive 13.

FIG. 13 depicts a configuration example of the imaging apparatus 1 inwhich the glass substrate 12, the adhesive 15, and the IRCF 14 arereplaced with a configuration having combined functions including thefunction of the glass substrate 12 and the function of the IRCF 14, theconfiguration is pasted onto the solid-state imaging element 11 by usingthe adhesive 13, and the lowermost-layer lens 131 is provided on theconfiguration. Note that configurations of the imaging apparatus 1 inFIG. 13 that have functions identical to configurations of the imagingapparatus 1 in FIG. 9 are given identical reference signs, andexplanations thereof are omitted as appropriate.

That is, the imaging apparatus 1 in FIG. 13 is different from theimaging apparatus 1 in FIG. 9 in that the glass substrate 12 and theIRCF 14 are replaced with an IRCF glass substrate 14′ having thefunction of the glass substrate 12 and the function of the IRCF 14, theIRCF glass substrate 14′ is pasted onto the solid-state imaging element11 by using the adhesive 13, and furthermore the lowermost-layer lens131 is provided on the IRCF 14′.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

That is, currently, for a size reduction of the solid-state imagingelement 11, in a structure referred to as the CSP (Chip Size Package)structure, the glass substrate 12 and the solid-state imaging element 11are adhered to each other, the glass substrate is used as the basesubstrate, the solid-state imaging element 11 is processed into a thinelement, and thereby it becomes possible to realize a small-sizedsolid-state imaging element. In FIG. 13 , the IRCF glass substrate 14′realizes the function as the glass substrate 12 having high flatness inaddition to the function of the IRCF 14, and thereby it becomes possibleto realize a height reduction.

Note that the glass substrate 12, the adhesive 15, and the IRCF 14 inthe imaging apparatus 1 in FIG. 1 , FIG. 11 and FIG. 12 according to thefirst embodiment, the third embodiment, and the fourth embodiment may bereplaced with the IRCF glass substrate 14′ having the function of theglass substrate 12 and the function of the IRCF 14.

6. Sixth Embodiment

Whereas the glass substrate 12 is pasted onto the solid-state imagingelement 11 having the CSP structure by using the adhesive 13,furthermore the IRCF 14 is pasted onto the glass substrate 12 by usingthe adhesive 15, and furthermore the lens group 171 including theplurality of lowermost-layer lenses in the plurality of lenses includedin the lens group 16 is provided on the IRCF 14 in the example explainedthe fourth embodiment, the solid-state imaging element 11 having the COB(Chip on Board) structure may be used instead of the solid-state imagingelement 11 having the CSP structure.

FIG. 14 depicts a configuration example in which the glass substrate 12and the IRCF 14 in the imaging apparatus 1 in FIG. 12 are replaced withthe IRCF glass substrate 14′ having the function of the glass substrate12 and the function of the IRCF 14, and also the solid-state imagingelement 11 having the COB (Chip on Board) structure is used instead ofthe solid-state imaging element 11 having the CSP structure. Note thatconfigurations of the imaging apparatus 1 in FIG. 14 that have functionsidentical to configurations of the imaging apparatus 1 in FIG. 12 aregiven identical reference signs, and explanations thereof are omitted asappropriate.

That is, the imaging apparatus 1 in FIG. 14 is different from theimaging apparatus 1 in FIG. 12 in that the glass substrate 12 and theIRCF 14 are replaced with the IRCF glass substrate 14′ having thefunction of the glass substrate 12 and the function of the IRCF 14, anda solid-state imaging element 91 having the COB (Chip on Board)structure is used instead of the solid-state imaging element 11 havingthe CSP structure.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 12 .

In addition, whereas the CSP structure is used typically for sizereductions of the solid-state imaging element 11 along with sizereductions of the imaging apparatus 1 in recent years, the CSP structurerequires complicated processing such as pasting together with the glasssubstrate 12 or the IRCF glass substrate 14′ or placement of wires forterminals of the solid-state imaging element 11 on the back side of thelight reception surface, and so the costs increase as compared with thesolid-state imaging element 11 having the COB structure. In view ofthis, not only the solid-state imaging element 11 having the CSPstructure, the solid-state imaging element 91 having the COB structureconnected with the circuit board 17 by a wire bond 92 or the like may beused.

Because, by using the solid-state imaging element 91 having the COBstructure, it is possible to make it easy to connect the solid-stateimaging element 91 to the circuit board 17, it becomes possible tosimplify processing, and the costs can be reduced.

Note that the solid-state imaging element 11 having the CSP structure inthe imaging apparatus 1 in FIG. 1 , FIG. 9 , FIG. 11 , and FIG. 13according to the first embodiment to the third embodiment and the fifthembodiment may be replaced with the solid-state imaging element 11having the COB (Chip on Board) structure.

7. Seventh Embodiment

Whereas the glass substrate 12 is provided on the solid-state imagingelement 11, and furthermore the IRCF 14 is provided on the glasssubstrate in the example explained in the second embodiment, the IRCF 14may be provided on the solid-state imaging element 11, and furthermorethe glass substrate 12 may be provided on the IRCF 14.

FIG. 15 depicts a configuration example of the imaging apparatus 1 inwhich the IRCF 14 is provided on the solid-state imaging element 11, andfurthermore the glass substrate 12 is provided on the IRCF 14 in a casewhere the glass substrate 12 is used.

The imaging apparatus 1 in FIG. 15 is different from the imagingapparatus 1 in FIG. 9 in that the glass substrate 12 and the IRCF 14 arereplaced with each other, the IRCF 14 is pasted onto the solid-stateimaging element 11 by using the transparent adhesive 13, furthermore theglass substrate 12 is pasted onto the IRCF 14 by using the transparentadhesive 15, and the lens 131 is provided on the glass substrate 12.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

In addition, the IRCF 14 typically has low flatness due to the influenceof temperatures or external disturbances characteristically, and thereis a fear that the IRCF 14 causes distortions in an image on thesolid-state imaging element 11.

In view of this, measures are typically taken by adopting a specialmaterial that maintains flatness by coating of a coating material or thelike on both surfaces of the IRCF 14, and so on, and this increases thecosts.

In contrast to this, the IRCF 14 having low flatness is sandwiched bythe solid-state imaging element 11 and the glass substrate 12 havinghigh flatness in the imaging apparatus 1 in FIG. 15 , thereby it becomespossible to ensure the flatness at low costs, and it becomes possible toreduce distortions of an image.

Accordingly, according to the imaging apparatus 1 in FIG. 15 , itbecomes possible to reduce occurrence of flares and ghosts, and also itbecomes possible to reduce distortions of an image caused by thecharacteristics of the IRCF 14. In addition, because a coating includinga special material to maintain the flatness becomes unnecessary, itbecomes possible to reduce the costs.

Note that the glass substrate 12 and the IRCF 14 may be replaced witheach other, and pasted by using the adhesives 13 and 15 also in theimaging apparatus 1 in FIG. 1 , FIG. 11 , and FIG. 12 according to thefirst embodiment, the third embodiment, and the fourth embodiment.

8. Eighth Embodiment

Whereas the IRCF 14 is used as a configuration to cut infrared light inthe example explained in the first embodiment, a configuration otherthan the IRCF 14 may be used as long as the configuration is capable ofcutting infrared light, and, for example, an infrared cut resin may beused for coating, instead of the IRCF 14.

FIG. 16 is a configuration example of the imaging apparatus 1 in whichan infrared cut resin is used instead of the IRCF 14. Note thatconfigurations of the imaging apparatus 1 in FIG. 16 that have functionsidentical to the imaging apparatus 1 in FIG. 1 are given identicalreference signs, and explanations thereof are omitted as appropriate.

That is, the imaging apparatus 1 in FIG. 16 is different from theimaging apparatus 1 in FIG. 1 in that an infrared cut resin 211 isprovided instead of the IRCF 14. The infrared cut resin 211 is providedby coating, for example.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 1 .

In addition, ones having infrared cut effects are used typically as aresult of further improvements of resins in recent years, and it hasbeen known that the glass substrate 12 can be coated with the infraredcut resin 211 at the time of production of the CSP solid-state imagingelement 11.

Note that the infrared cut resin 211 may be used instead of the IRCF 14in the imaging apparatus 1 in FIG. 9 , FIG. 11 , FIG. 12 , and FIG. 15according to the second embodiment to the fourth embodiment and theseventh embodiment.

9. Ninth Embodiment

Whereas the glass substrate 12 which is a flat plate is provided on thesolid-state imaging element 11 in an adhered state that there are nocavities or the like therebetween in a case where the glass substrate 12is used in the example explained in the second embodiment, a cavity maybe provided between the glass substrate 12 and the solid-state imagingelement 11.

FIG. 17 depicts a configuration example of the imaging apparatus 1 inwhich a cavity is provided between the glass substrate 12 and thesolid-state imaging element 11. Configurations of the imaging apparatus1 in FIG. 17 that have functions identical to configurations of theimaging apparatus 1 in FIG. 9 are given identical reference signs, andexplanations thereof are omitted as appropriate.

That is, the imaging apparatus 1 in FIG. 17 is different from theimaging apparatus in FIG. 9 in that a glass substrate 231 including aconvexity 231 a on its circumference is provided instead of the glasssubstrate 12. The convexity 231 a at the circumference abuts against thesolid-state imaging element 11, and the convexity 231 a is adhered ontothe solid-state imaging element 11 by using a transparent adhesive 232.Thereby, a cavity 231 b including an air layer is formed between theglass substrate 231 and the imaging surface of the solid-state imagingelement 11.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

Note that the glass substrate 231 may be used instead of the glasssubstrate 12 in the imaging apparatus 1 in FIG. 1 , FIG. 11 , FIG. 12 ,and FIG. 16 according to the first embodiment, the third embodiment, thefourth embodiment, and the eighth embodiment, and only the convexity 231a may be adhered by using the adhesive 232 to thereby form the cavity231 b.

10. Tenth Embodiment

Whereas the lowermost-layer lens 131 in the lens group 16 is configuredon the IRCF 14 provided on the glass substrate 12 in the example in thesecond embodiment, a coating agent of an organic multilayer film havingan infrared cut function may be included instead of the IRCF 14 on theglass substrate 12.

FIG. 18 depicts a configuration example of the imaging apparatus 1including a coating agent of an organic multilayer film having aninfrared cut function instead of the IRCF 14 on the glass substrate 12.

The imaging apparatus 1 in FIG. 18 is different from the imagingapparatus 1 in FIG. 9 in that a coating agent 251 of an organicmultilayer film having an infrared cut function is included instead ofthe IRCF 14 on the glass substrate 12.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

Note that the coating agent 251 of the organic multilayer film havingthe infrared cut function may be used instead of the IRCF 14 in theimaging apparatus 1 in FIG. 1 , FIG. 6 , FIG. 7 , FIG. 10 , and FIG. 12according to the first embodiment, the third embodiment, the fourthembodiment, the seventh embodiment, and the ninth embodiment.

11. Eleventh Embodiment

Whereas the lowermost-layer lens 131 in the lens group 16 is included onthe coating agent 251 of the organic multilayer film having the infraredcut function instead of the IRCF 14 on the glass substrate 12 in theexample explained in the tenth embodiment, furthermore an AR (AntiReflection) coat may be provided on the lens 131.

FIG. 19 depicts a configuration example of the imaging apparatus 1 inwhich an AR coat is provided on the lens 131 in the imaging apparatus 1in FIG. 13 .

That is, the imaging apparatus 1 in FIG. 19 is different from theimaging apparatus 1 in FIG. 18 in that a lowermost-layer lens 271 thatis included in the lens group 16, and provided with an AR coat 271 a isprovided instead of the lens 131. One that is formed, for example, byvacuum deposition, sputtering, WET coating, or the like can be adoptedas the AR coat 271 a.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

In addition, because the AR coat 271 a of the lens 271 reduces internaldiffused reflection of reflection light from the solid-state imagingelement 11, it becomes possible to reduce occurrence of flares andghosts more reliably.

Note that the lens 271 provided with the AR coat 271 a may be usedinstead of the lens 131 in the imaging apparatus 1 in FIG. 9 , FIG. 11 ,FIG. 13 , FIG. 15 , FIG. 17 , and FIG. 18 according to the secondembodiment, the third embodiment, the fifth embodiment, the seventhembodiment, the ninth embodiment, and the tenth embodiment. In addition,an AR coat similar to the AR coat 271 a may be provided on the surface(the uppermost surface in the figures) of the lens group 171 in theimaging apparatus 1 in FIG. 12 and FIG. 14 according to the fourthembodiment and the sixth embodiment.

It is desirable if the AR coat 271 a is a single layer film or amultilayer structure film of the following films. That is, the AR coat271 a is, for example, a transparent silicon resin, an acrylic resin, anepoxy resin, a resin such as a styrene resin, an insulating film (e.g.SiCH, SiCOH, and SiCNH) including Si (silicon), C (carbon), and H(hydrogen) as its principal components, an insulating film (e.g. SiONand SiN) including Si (silicon) and N (nitrogen) as its principalcomponents, an SiO2 film formed by using an oxidant and a material gaswhich is at least any of silicon hydroxide, alkylsilane, alkoxysilane,polysiloxane, or the like, a P—SiO film, an HDP-SiO film, or the like.

12. Twelfth Embodiment

Whereas the lens 271 provided with the AR (Anti Reflection) coat 271 ais used instead of the lens 131 in the example explained in the eleventhembodiment, a configuration other than an AR coat may be adopted as longas an anti-reflection function can be realized, and, for example, a mosseye structure which is a minute concave and convex structure thatprevents reflection may be adopted.

FIG. 20 depicts a configuration example of the imaging apparatus 1 inwhich a lens 291 provided with an anti-reflection function realized by amoss eye structure is provided instead of the lens 131 in the imagingapparatus 1 in FIG. 19 .

That is, the imaging apparatus 1 in FIG. 20 is different from theimaging apparatus 1 in FIG. 18 in that a lowermost-layer lens 291 thatis included in the lens group 16, and provided with an anti-reflectiontreatment section 291 a having been subjected to a process for forming amoss eye structure is provided instead of the lens 131.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 18 .

In addition, because the lens 291 is provided with the anti-reflectiontreatment section 291 a having been subjected to the process for formingthe moss eye structure, and reduces internal diffused reflection ofreflection light from the solid-state imaging element 11, it becomespossible to reduce occurrence of flares and ghosts more reliably. Notethat the anti-reflection treatment section 291 a may be one that hasbeen subjected to an anti-reflection treatment other than the processfor forming the moss eye structure as long as an anti-reflectionfunction can be realized.

It is desirable if the anti-reflection treatment section 291 a is asingle layer film or a multilayer structure film of the following films.That is, the anti-reflection treatment section 291 a is, for example, atransparent silicon resin, an acrylic resin, an epoxy resin, a resinsuch as a styrene resin, an insulating film (e.g. SiCH, SiCOH, andSiCNH) including Si (silicon), C (carbon), and H (hydrogen) as itsprincipal components, an insulating film (e.g. SiON and SiN) includingSi (silicon) and N (nitrogen) as its principal components, an SiO2 filmformed by using an oxidant and a material gas which is at least any ofsilicon hydroxide, alkylsilane, alkoxysilane, polysiloxane or the like,a P—SiO film, an HDP-SiO film, or the like.

Note that the lens 291 provided with the anti-reflection treatmentsection 291 a may be used instead of the lens 131 in the imagingapparatus 1 in FIG. 9 , FIG. 11 , FIG. 13 , FIG. 15 , FIG. 17 , and FIG.18 according to the second embodiment, the third embodiment, the fifthembodiment, the seventh embodiment, the ninth embodiment, and the tenthembodiment. In addition, an anti-reflection treatment similar to thetreatment for forming the anti-reflection treatment section 291 a may beperformed on a surface of the lens group 171 in the imaging apparatus 1in FIG. 12 and FIG. 14 according to the fourth embodiment and the sixthembodiment.

13. Thirteenth Embodiment

Whereas the lowermost-layer lens 131 in the lens group 16 is provided onthe IRCF 14 in the example explained in the fourth embodiment, aconfiguration having an infrared cut function and a function similar tothe function of the lowermost-layer lens 131 may replace thelowermost-layer lens 131.

FIG. 21 depicts a configuration example of the imaging apparatus 1 inwhich an infrared cut lens having an infrared cut function and afunction similar to the function of the lowermost-layer lens in the lensgroup 16 is provided instead of the IRCF 14 and the lowermost-layer lens131 in the lens group 16 in the imaging apparatus 1 in FIG. 9 .

That is, the imaging apparatus 1 in FIG. 21 is different from theimaging apparatus 1 in FIG. 9 in that an infrared cut lens 301 providedwith an infrared cut function is provided instead of the IRCF 14 and thelowermost-layer lens 131 in the lens group 16.

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

In addition, because the infrared cut lens 301 is a configuration havingcombined functions including the infrared cut function and the functionas the lowermost-layer lens 131 in the lens group 16, it is notnecessary to separately provide the IRCF 14 and the lens 131, and so itbecomes possible to further reduce the size and height of the apparatusconfiguration of the imaging apparatus 1. In addition, an infrared cutlens having combined functions including an infrared cut function andthe function as the lens group 171 including a plurality of lenses inthe lowermost-layers in the lens group 16 may replace the lens group 171and the IRCF 14 in the imaging apparatus 1 in FIG. 12 according to thefourth embodiment.

14. Fourteenth Embodiment

It is known that stray light easily gets in from the side rim section ofthe light reception surface of the solid-state imaging element 11. Inview of this, occurrence of flares and ghosts may be reduced byproviding a black mask at the side rim section of the light receptionsurface of the solid-state imaging element 11, and reducing entrance ofstray light.

The left portion in FIG. 22 depicts a configuration example of theimaging apparatus 1 in which a glass substrate 321 provided with a blackmask 321 a that blocks light at the side rim section of the lightreception surface of the solid-state imaging element 11 is providedinstead of the glass substrate 12 in the imaging apparatus 1 in FIG. 18.

That is, the imaging apparatus 1 in the left portion in FIG. 22 isdifferent from the imaging apparatus 1 in FIG. 18 in that, instead ofthe glass substrate 12, the glass substrate 321 provided with the blackmask 321 a including a light blocking film is provided at a side rimsection Z2 as depicted in the right portion in FIG. 22 . The black mask321 a is provided to the glass substrate 321 by photolithography or thelike. Note that a black mask is not provided to a central section Z1 ofthe glass substrate 321 in the right portion in FIG. 22 .

In such a configuration also, it becomes possible to reduce occurrenceof flares and ghosts similarly to the imaging apparatus 1 in FIG. 9 .

In addition, because the glass substrate 321 is provided with the blackmask 321 a at the side rim section Z2, it is possible to reduce entranceof stray light from the side rim section, and it becomes possible toreduce occurrence of flares and ghosts resulting from stray light.

Note that the black mask 321 a may be provided not only to the glasssubstrate 321, but to another configuration as long as it is possible toprevent entrance of stray light to the solid-state imaging element 11.For example, the black mask 321 a may be provided to the lens 131 or thecoating agent 251 of the organic multilayer film having the infrared cutfunction or may be provided to the IRCF 14, the IRCF glass substrate14′, the glass substrate 231, the lens group 171, the lens 271 or 291,the infrared cut resin 211, the infrared cut lens 301, or the like. Notethat in a case where, at this time, the flatness of the surface is low,and it is not possible to provide a black mask by photolithography, forexample, a black mask may be provided to the surface having low flatnessby inkjet.

As mentioned above, according to the present disclosure, it becomespossible to reduce flares and ghosts resulting from internal diffusedreflection of light from the solid-state imaging element thataccompanies a size reduction, and also it becomes possible to realize alarger pixel count, a higher image quality, and a size reduction withoutdeteriorating the performance of the imaging apparatus.

15. Fifteenth Embodiment

In the examples explained thus far, the lens 131, 271, or 291, the lensgroup 171, or the infrared cut lens 301 is joined on the rectangularsolid-state imaging element 11 by adhesion, pasting, or the like.

However, if any of the rectangular lenses 131, 271, and 291, the lensgroup 171, and the infrared cut lens 301 is adhered or pasted onto thesolid-state imaging element 11 having substantially the same size,portions near angled sections peel off more easily, incident light doesnot enter the solid-state imaging element 11 appropriately due topeeling of the angled sections of the lens 131, and there is a fear thatflares and ghosts occur.

In view of this, in a case where any of the rectangular lenses 131, 271,and 291, the lens group 171, and the infrared cut lens 301 is adhered orpasted onto the solid-state imaging element 11, the outline dimensionmay be set smaller than the outline dimension of the solid-state imagingelement 11, furthermore an effective region may be set near the centerof the lens, and also a non-effective region may be set at the outercircumferential section. Thereby, the likelihood that the rectangularlens 131, 271 or 291, the lens group 171, or the infrared cut lens 301peels off may be reduced or it may be made possible to condense incidentlight effectively even if the end section peels off slightly.

That is, in a case where the lens 131 is adhered or pasted onto theglass substrate 12 provided on the solid-state imaging element 11, forexample, as depicted in FIG. 23 , the outline dimension of the lens 131is made smaller than the glass substrate 12 on the solid-state imagingelement 11, additionally a non-effective region 131 b is set at theouter circumferential section of the lens 131, and an effective region131 a is set inside the non-effective region 131 b. Note that, insteadof the glass substrate 12, the glass substrate 231 may be provided onthe solid-state imaging element 11.

In addition, whereas the configuration in FIG. 23 is a configuration inwhich the IRCF 14 and the adhesive 15 in the integrated configurationsection 10 of the imaging apparatus 1 in FIG. 9 are omitted, the IRCF 14and the adhesive 15 are omitted only for convenience of the explanation,and certainly may be provided between the lens 131 and the glasssubstrate 12.

Furthermore, here, the effective region 131 a is a region that is in aregion of the lens 131 where incident light enters, has an asphericalshape, and effectively functions to condense the incident light onto aregion of the solid-state imaging element 11 where photoelectricconversion is possible. Stated differently, the effective region 131 ais a region that has a concentric structure in which an aspherical lensstructure is formed, and is inscribed in the lens outer circumferentialsection. The effective region is a region that condenses incident lightonto the imaging surface of the solid-state imaging element 11 wherephotoelectric conversion is possible.

On the other hand, the non-effective region 131 b is a region that doesnot necessarily function as a lens that condenses incident lightentering the lens 131 onto the region in the solid-state imaging element11 where photoelectric conversion is performed.

It should be noted that it is desirable if the boundary of thenon-effective region 131 b that faces the effective region 131 a has astructure which is an extension of a structure that functions as a lenshaving a partially aspherical shape. By providing, in the non-effectiveregion 131 b, the structure that functions as a lens, and is anextension near the boundary that faces the effective region 131 a insuch a manner, it becomes possible to condense incident lightappropriately onto the imaging surface of the solid-state imagingelement 11 even if a positional misalignment occurs when the lens 131 isadhered or pasted onto the glass substrate 12 on the solid-state imagingelement 11.

Note that, in FIG. 23 , the size of the glass substrate 12 on thesolid-state imaging element 11 has a height Vs in the vertical direction(Y direction) and a width Hs in the horizontal direction (X direction),and the lens 131 having the size with a height Vn in the verticaldirection and a width Hn in the horizontal direction which is smallerthan the size of the solid-state imaging element 11 (glass substrate 12)is adhered or pasted onto the central portion on the inner side of theglass substrate 12 on the solid-state imaging element 11. Furthermore,the non-effective region 131 b that does not function as a lens is setat the outer circumferential section of the lens 131, and the effectiveregion 131 a having the size with a height Ve in the vertical directionand a width He in the horizontal direction is set inside thenon-effective region 131 b.

Stated differently, there is a relation in terms of both horizontalwidths and vertical heights that the width and length of the effectiveregion 131 a of the lens 131 are smaller than the width and length ofthe non-effective region 131 b which are smaller than the width andlength of the outline size of (the glass substrate 12 on) thesolid-state imaging element 11, and the central positions of the lens131, the effective region 131 a, and the non-effective region 131 b aresubstantially identical.

In addition, in FIG. 23 , a top view as seen from the side of thedirection of incidence of light when the lens 131 is adhered or pastedonto the glass substrate 12 on the solid-state imaging element 11 isdepicted in the upper portion in the figure, and an external appearanceperspective view as seen when the lens 131 is adhered or pasted onto theglass substrate 12 on the solid-state imaging element 11 is depicted inthe lower left portion in the figure.

Furthermore, the lower right portion in the figure of FIG. 23 depicts,about the end section in the external appearance perspective view asseen when the lens 131 is adhered or pasted onto the glass substrate 12on the solid-state imaging element 11, a boundary B1 between the glasssubstrate 12 and the side-surface section of the lens 131, a boundary B2on the outer side of the non-effective region 131 b, and a boundary B3between the outer side of the effective region 131 a and the inner sideof the non-effective region 131 b.

Here, the side-surface end section of the lens 131 is vertical to theglass substrate 12 on the solid-state imaging element 11 in the exampledepicted in FIG. 23 . Because of this, in the top view of FIG. 23 , theouter boundary B2 of the non-effective region 131 b is formed at the topsurface section of the lens 131, and the boundary B1 between theeffective region 131 a and the non-effective region 131 b is formed atthe lower surface section of the lens 131. Accordingly, the outerboundary B2 and the boundary B1 have identical sizes. Thereby, in theupper portion in FIG. 23 , the outer circumferential section (boundaryB1) of the lens 131 and the outer circumferential section (boundary B2)of the non-effective region 131 b are expressed as having identicaloutlines.

Because, according to such a configuration, a space is formed betweenthe side surface as the outer circumferential section of the lens 131and the outer circumferential section of the glass substrate 12 on thesolid-state imaging element 11, it becomes possible to reduceinterference between the side-surface section of the lens 131 andanother object, and it becomes possible to adopt a configuration thatreduces the likelihood that the lens 131 peels off from the glasssubstrate 12 on the solid-state imaging element 11.

In addition, by setting the effective region 131 a of the lens 131 inthe non-effective region 131 b, it becomes possible to condense incidentlight appropriately onto the imaging surface of the solid-state imagingelement 11 even if the peripheral section peels off a little. Inaddition, because if peeling of the lens 131 occurs, interfacialreflection increases, and flares and ghosts worsen, it becomes possibleto reduce occurrence of flares and ghosts as a result of a reduction ofpeeling.

Note that whereas the lens 131 is adhered or pasted onto the glasssubstrate 12 on the solid-state imaging element 11 in the exampleexplained with reference to FIG. 23 , certainly, the lens 131 may bereplaced with any of the lenses 271 and 291, the lens group 171, and theinfrared cut lens 301.

Modification Examples of Outline Shape of Lens

In the examples explained thus far, the effective region 131 a is set atthe central section of the lens 131, the non-effective region 131 b isset at the outer circumferential section of the effective region 131 a,furthermore the effective region 131 a has a size smaller than the outercircumferential size of (the glass substrate 12 on) the solid-stateimaging element 11, and all of the four corners of the outline shape ofthe lens 131 include shapes having acute angles.

However, as long as the size of the lens 131 is set smaller than thesize of (the glass substrate 12 on) the solid-state imaging element 11,the effective region 131 a is set at the central section of the lens131, and the non-effective region 131 b is set at the outercircumferential section of the effective region 131 a, the outline shapemay be another shape.

That is, as depicted in the upper left portion in FIG. 24 (correspondingto FIG. 23 ), a region 2301 at each of the four corners of the outlineshape of the lens 131 may include a shape having an acute angle. Inaddition, as represented by a lens 131′ in the upper right portion inFIG. 24 , a region 2302 of each of the four corners may be a polygonalshape including obtuse angles.

In addition, as represented by a lens 131″ in the central left portionin FIG. 24 , a region 2303 of each of the four corners of the outlineshape may be a circular shape.

Furthermore, as represented by a lens 131′″ in the central right portionin FIG. 24 , a region 2304 of each of the four corners of the outlineshape may be a shape having a small rectangular section protruding fromthe corner. In addition, the protruding shape may be a shape other thana rectangle, and, for example, may be a shape such as a circle, an oval,or a polygon.

In addition, as represented by a lens 131″″ in the lower left portion inFIG. 24 , a region 2305 of each of the four corners of the outline shapemay be a rectangularly concave shape.

Furthermore, as represented by a lens 131′″″ in the lower right portionin FIG. 24 , the effective region 131 a may be given a rectangularshape, and the outer circumferential section of the non-effective region131 b may be given a circular shape.

That is, the likelihood that angled sections of the lens 131 peel offfrom the glass substrate 12 increases as the angles of the anglesections decrease, and there is a fear that the peeling has opticallynegative influence. In view of this, by giving the angled sectionsshapes including polygons which have obtuse angles larger than 90degrees, rounded shapes, shapes provided with concavities orconvexities, or the like as represented by the lenses 131′ to 131′″″ inFIG. 24 , it becomes possible to give the lens 131 a configuration thatreduces the likelihood that the lens 131 peels off from the glasssubstrate 12, and to reduce the risk of optically negative influence.

Modification Examples of Structure of Lens End Section

In the examples explained thus far, the end section of the lens 131 isformed vertically to the imaging surface of the solid-state imagingelement 11. However, as long as the size of the lens 131 is set smallerthan the size of the solid-state imaging element 11, the effectiveregion 131 a is set at the central section of the lens 131, and thenon-effective region 131 b is set at the outer circumferential sectionof the effective region 131 a, the end section may be formed in anothershape.

That is, as depicted in the upper left portion in FIG. 25 , aconfiguration similar to the effective region 131 a as a lens having anaspherical surface may be formed as an extension at the boundary of thenon-effective region 131 b that faces the effective region 131 a, and,as represented by an end section Z331 of the non-effective region 131 b,the end section may be formed vertically (corresponding to theconfiguration in FIG. 23 ).

In addition, as depicted in the second example from left in the upperportion in FIG. 25 , a configuration similar to the effective region 131a as a lens having an aspherical surface may be formed as an extensionat the boundary of the non-effective region 131 b that faces theeffective region 131 a, and, as represented by an end section 2332 ofthe non-effective region 131 b, the end section may be formed in atapered shape.

Furthermore, as depicted in the third example from left in the upperportion in FIG. 25 , a configuration similar to the effective region 131a as a lens having an aspherical surface may be formed as an extensionat the boundary of the non-effective region 131 b that faces theeffective region 131 a, and, as represented by an end section 2333 ofthe non-effective region 131 b, the end section may be formed in arounded shape.

In addition, as depicted in the upper right portion in FIG. 25 , aconfiguration similar to the effective region 131 a as a lens having anaspherical surface may be formed as an extension at the boundary of thenon-effective region 131 b that faces the effective region 131 a, and,as represented by an end section 2334 of the non-effective region 131 b,the end section may be formed as a multi-step structure side surface.

Furthermore, as depicted in the lower left portion in FIG. 25 , aconfiguration similar to the effective region 131 a as a lens having anaspherical surface may be formed as an extension at the boundary of thenon-effective region 131 b that faces the effective region 131 a. Asrepresented by an end section 2335 of the non-effective region 131 b, abank-like protrusion including a horizontally planar section at the endsection, and protruding relative to the effective region 131 a in adirection opposite to the direction of incidence of incident light maybe formed, and the side surface of the protrusion may be formedvertically.

In addition, as depicted in the second example from left in the lowerportion in FIG. 25 , a configuration similar to the effective region 131a as a lens having an aspherical surface may be formed as an extensionat the boundary of the non-effective region 131 b that faces theeffective region 131 a. As represented by an end section 2336 of thenon-effective region 131 b, a bank-like protrusion including ahorizontally planar section at the end section, and protruding relativeto the effective region 131 a in a direction opposite to the directionof incidence of incident light may be formed, and the side surface ofthe protrusion may be formed in a tapered shape.

Furthermore, as depicted in the third example from left in the lowerportion in FIG. 25 , a configuration similar to the effective region 131a as a lens having an aspherical surface may be formed as an extensionat the boundary of the non-effective region 131 b that faces theeffective region 131 a. As represented by an end section 2337 of thenon-effective region 131 b, a bank-like protrusion including ahorizontally planar section at the end section, and protruding relativeto the effective region 131 a in a direction opposite to the directionof incidence of incident light may be formed, and the side surface ofthe protrusion may be formed in a rounded shape.

In addition, as depicted in the lower right portion in FIG. 25 , aconfiguration similar to the effective region 131 a as a lens having anaspherical surface may be formed as an extension at the boundary of thenon-effective region 131 b that faces the effective region 131 a. Asrepresented by an end section 2338 of the non-effective region 131 b, abank-like protrusion including a horizontally planar section at the endsection, and protruding relative to the effective region 131 a in adirection opposite to the direction of incidence of incident light maybe formed, and the side surface of the protrusion may be formed to havea multi-step structure.

Note that the upper row in FIG. 25 depicts structure examples in whichthe end section of the lens 131 is not provided with a bank-likeprotrusion including a horizontally planar section, and protrudingrelative to the effective region 131 a in the direction opposite to thedirection of incidence of incident light, and the lower row depictsstructure examples in which the end section of the lens 131 is notprovided with a protrusion including a horizontally planar section. Inaddition, both the upper row and lower row in FIG. 25 depict, in thefollowing order from left, examples in which the end section of the lens131 is configured vertically to the glass substrate 12, examples inwhich the end section includes a tapered shape, examples in which theend section includes a rounded shape and examples in which the endsection is configured to have a multi-step structure having a pluralityof side surfaces.

In addition, as depicted in the upper portion in FIG. 26 , aconfiguration similar to the effective region 131 a as a lens having anaspherical surface may be formed as an extension at the boundary of thenon-effective region 131 b that faces the effective region 131 a. Asrepresented by an end section 2351 of the non-effective region 131 b, aprotrusion may be formed vertically to the glass substrate 12, andfurthermore a rectangular boundary structure Es may be configured beingleft at the boundary of the non-effective region 131 b that faces theglass substrate 12 on the solid-state imaging element 11.

Furthermore, as depicted in the lower portion in FIG. 26 , aconfiguration similar to the effective region 131 a as a lens having anaspherical surface may be formed as an extension at the boundary of thenon-effective region 131 b that faces the effective region 131 a. Asrepresented by an end section 2352 of the non-effective region 131 b, aprotrusion may be formed vertically to the glass substrate 12, andfurthermore a rounded boundary structure Er may be configured being leftat the boundary of the non-effective region 131 b that faces the glasssubstrate 12 on the solid-state imaging element 11.

Both the rectangular boundary structure Es and the rounded boundarystructure Er increase the area size of contact between the lens 131 andthe glass substrate 12, and thereby it becomes possible to join the lens131 and the glass substrate 12 together by stronger adhesion. As aresult, it becomes possible to reduce peeling of the lens 131 off fromthe glass substrate 12.

Note that the rectangular boundary structure Es and the rounded boundarystructure Er may be used in any of the cases that the end section isformed in a tapered shape, the cases that the end section is formed in arounded shape and the cases that the end section is formed to have amulti-step structure.

In addition, as depicted in FIG. 27 , a configuration similar to theeffective region 131 a as a lens having an aspherical surface may beformed as an extension at the boundary of the non-effective region 131 bthat faces the effective region 131 a. As represented by an end section2371 of the non-effective region 131 b, the side surface of the lens 131may be formed vertically to the glass substrate 12, and furthermore arefractive film 351 having a predetermined refractive index and a heightwhich is substantially identical to the height of the lens 131 may beconfigured on the glass substrate 12 at the outer circumferentialsection of the lens 131.

Thereby, for example, in a case where the refractive film 351 has arefractive index higher than a predetermined refractive index, therefractive film 351 reflects, to the outer side of the lens 131,incident light advancing toward the outer circumferential section of thelens 131 as represented by a solid line arrow in the upper portion inFIG. 27 in a case where there is such incident light, and also reducesincident light that enters the side-surface section of the lens 131 asrepresented by a dotted arrow. As a result, entrance of stray light intothe lens 131 is reduced, and so occurrence of flares and ghosts isreduced.

In addition, in a case where the refractive film 351 has a refractiveindex lower than a predetermined refractive index, the refractive film351 transmits light that does not enter the incidence surface of thesolid-state imaging element 11, and advancing to be transmitted to theoutside of the lens 131 from the side surface of the lens 131 asrepresented by a solid line arrow in the lower portion in FIG. 27 , andalso reduces reflection light from the side surface of the lens 131 asrepresented by a dotted arrow. As a result, entrance of stray light tothe lens 131 is reduced, and so it becomes possible to reduce occurrenceof flares and ghosts.

Furthermore, whereas the refractive film 351 is formed to have a heightwhich is identical to the height of the lens 131 on the glass substrate12, and additionally have an end section that is formed vertically inthe example explained with reference to FIG. 27 , the refractive film351 may have another shape.

For example, as represented by a region 2391 in the upper left portionin FIG. 28 , the refractive film 351 may be formed to include a taperedshape at the end section on the glass substrate 12, and may additionallyhave a configuration having a thickness larger than the height of theend section of the lens 131.

In addition, for example, as represented by a region 2392 in the centralupper portion in FIG. 28 , the refractive film 351 may be formed toinclude a tapered shape at the end section, may additionally have aconfiguration having a thickness larger than the height of the endsection of the lens 131, and furthermore may have a configurationpartially covering the non-effective region 131 b of the lens 131.

Furthermore, for example, as represented by a region 2393 in the upperright portion in FIG. 28 , the refractive film 351 may have aconfiguration in which a tapered shape includes the height of the endsection of the lens 131 to the end section of the glass substrate 12.

In addition, for example, as represented by a region 2394 in the lowerleft portion in FIG. 28 , the refractive film 351 may have aconfiguration formed in a tapered shape at the end section of the glasssubstrate 12, and additionally having a thickness smaller than theheight of the end section of the lens 131.

Furthermore, for example, as represented by a region 2395 in the lowerright portion in FIG. 28 , the refractive film 351 may have aconfiguration which is concave toward the glass substrate 12 relative tothe height of the end section of the lens 131, and additionally isformed in a rounded shape.

In any of the configurations in FIG. 27 and FIG. 28 , entrance of straylight to the lens 131 is reduced, and so it becomes possible to reduceoccurrence of flares and ghosts.

16. Sixteenth Embodiment

Whereas flares and ghosts are reduced by adopting a configuration inwhich the likelihood that the lens 131 peels off from the glasssubstrate 12 is reduced, a configuration in which entrance of straylight is reduced, and so on in the examples explained thus far, flaresand ghosts may be reduced by adopting a configuration that reduces burrsof an adhesive that are generated at the time of processing.

That is, in the case of configurations to be considered next, asdepicted on the upper row in FIG. 29 , the IRCF 14 is formed on thesolid-state imaging element 11, and the glass substrate 12 is adheredonto the IRCF 14 by using the adhesive 15 (e.g. the case of theconfiguration according to the seventh embodiment in FIG. 15 ). Notethat configurations in FIG. 29 correspond to configurations other thanthe lens in the integrated configuration section 10 in the imagingapparatus 1 in FIG. 15 .

In this case, the IRCF 14 needs to have a film thickness which is largeto some extent, but typically it is difficult to increase the viscosityof the material of the IRCF 14, and a desired film thickness cannot beformed at once. However, if recoating is performed, micro voids aregenerated or inclusion of bubbles occurs, and there is a fear that theoptical characteristics deteriorate.

In addition, the glass substrate 12 is adhered by using the adhesive 15after the IRCF 14 is formed on the solid-state imaging element 11, butbecause a warp occurs due to curing contraction of the IRCF 14, there isa fear that a failure of the joint between the glass substrate 12 andthe IRCF 14 occurs. Furthermore, a warp of the IRCF 14 cannot beforcibly corrected only by the glass substrate 12, and there is a fearthat a warp of the device as a whole occurs, and the opticalcharacteristics deteriorate.

Furthermore, in particular, in a case where the glass substrate 12 andthe IRCF 14 are joined together via the adhesive 15, a resin burrresulting from the adhesive 15 occurs as represented by an area 2411 inthe upper portion in FIG. 29 at the time of dicing, and there is a fearthat the working accuracy is lowered at the time of implementation suchas pickup.

In view of this, as depicted in the central portion in FIG. 29 , theIRCF 14 is divided into two layers, IRCFs 14-1 and 14-2, and the IRCFs14-1 and 14-2 are adhered to each other by using the adhesive 15.

According to such a configuration, when the IRCFs 14-1 and 14-2 areformed, it becomes possible to form the IRCFs 14-1 and 14-2 thinseparately, and so formation of a thick film for obtaining desiredspectral characteristics becomes easy (separate formation).

In addition, the glass substrate 12 can be joined with the solid-stateimaging element 11 while steps (sensor steps such as PAD) on thesolid-state imaging element 11 are flattened by using the IRCF 14-2.Accordingly, it becomes possible to reduce the film thickness of theadhesive 15. As a result, it becomes possible to reduce the height ofthe imaging apparatus 1.

Furthermore, a warp is cancelled out by the IRCFs 14-1 and 14-2 that areformed on the glass substrate 12 and the solid-state imaging element 11,respectively, and it becomes possible to reduce warps of the devicechip.

In addition, the elastic modulus of glass is higher than the elasticmodulus of the IRCFs 14-1 and 14-2. By making the elastic modulus of theIRCFs 14-1 and 14-2 higher than the elastic modulus of the adhesive 15,it becomes possible to reduce occurrence of resin burrs at the time ofdicing (Expand) as represented by an area 2412 in the upper portion inFIG. 29 because the top and bottom of the adhesive 15 having lowelasticity is covered with the IRCFs 14-1 and 14-2 having an elasticmodulus higher than the elastic modulus of the adhesive 15 at the timeof dicing.

Furthermore, as depicted in the lower portion in FIG. 29 , IRCFs 14′-1and 14′-2 having functions as adhesives may be formed, and directlypasted together such that the IRCFs 14′-1 and 14′-2 face each other. Bydoing so, occurrence of resin burrs of the adhesive 15 that occur at thetime of dicing can be reduced.

<Manufacturing Method>

Next, with reference to FIG. 30 , a manufacturing method in which theadhesive 15 is sandwiched by the IRCFs 14-1 and 14-2 to join the glasssubstrate 12 with the solid-state imaging element 11 depicted in thecentral portion in FIG. 29 is explained.

At a first step, as depicted in the upper left portion in FIG. 30 , theIRCF 14-1 is formed on the glass substrate 12 by coating. In addition,the IRCF 14-2 is formed on the solid-state imaging element 11 bycoating. Note that the upper left portion in FIG. 30 depicts avertically reversed state of the glass substrate 12 after the IRCF 14-2is formed by coating.

At a second step, as depicted in the central upper portion in FIG. 30 ,the adhesive 15 is applied onto the IRCF 14-2 by coating.

At a third step, as depicted in the upper right portion in FIG. 30 , theIRCF 14-1 on the glass substrate 12 is pasted together onto the adhesive15 depicted in the central upper portion in FIG. 30 such that the IRCF14-1 faces the surface onto which the adhesive 15 has been applied bycoating.

At a fourth step, as depicted in the lower left portion in FIG. 30 ,electrodes are formed on the backside of the solid-state imaging element11.

At a fifth step, as depicted in the central lower portion in FIG. 30 ,the glass substrate 12 is formed into a thin film by polishing.

Then, dicing is performed by cutting the end section by a blade or thelike after the fifth step, and the solid-state imaging element 11 inwhich the IRCFs 14-1 and 14-2 are stacked on the imaging surface, andfurthermore the glass substrate 12 is formed on the IRCFs 14-1 and 14-2is completed.

As a result of the steps above, the adhesive 15 is sandwiched by theIRCFs 14-1 and 14-2, and so it becomes possible to reduce occurrence ofburrs accompanying the dicing.

In addition, because it becomes possible to form the IRCFs 14-1 and 14-2each of which forms a half of a required film thickness, and thethickness that needs to be obtained by recoating can be reduced orrecoating becomes unnecessary, it becomes possible to reduce generationof micro voids or occurrence of inclusion of bubbles, and to reducedeterioration of the optical characteristics.

Furthermore, because the film thickness of each of the IRCFs 14-1 and14-2 is small, it becomes possible to reduce warps due to curingcontraction, it becomes possible to reduce occurrence of a failure ofthe joint between the glass substrate 12 and the IRCF 14, and it becomespossible to reduce deterioration of the optical characteristicsresulting from warps.

Note that because, in a case where the IRCFs 14′-1 and 14′-2 havingfunctions of adhesives are used as depicted in the lower portion in FIG.29 , the step of applying the adhesive 15 by coating is simply omitted,an explanation about such a case is omitted.

Modification Examples of Side Surface Shape after Dicing

When the solid-state imaging element 11 on which the IRCFs 14-1 and 14-2are formed, and furthermore the glass substrate 12 is formed accordingto the manufacturing method mentioned above is to be diced, as apremise, the end section is cut by a blade or the like such that theside-surface cross-section becomes vertical to the imaging surface.

However, the influence of dropped garbage resulting from the glasssubstrate 12, the IRCFs 14-1 and 14-2 and the adhesive 15 may be reducedfurther by adjusting the shape of the side-surface cross-section of theIRCFs 14-1 and 14-2, and the glass substrate 12 formed on thesolid-state imaging element 11.

For example, as depicted in the upper left portion in FIG. 31 , theside-surface cross-section may be formed such that the horizontaloutline shape of the solid-state imaging element 11 is the largest, andthe outline shapes of all of the glass substrate 12, the IRCFs 14-1 and14-2, and the adhesive 15 are the same and additionally are smaller thanthe horizontal outline shape of the solid-state imaging element 11.

Furthermore, as depicted in the upper right portion in FIG. 31 , theside-surface cross-section may be formed such that the horizontaloutline shape of the solid-state imaging element 11 is the largest, theoutline shapes of the IRCFs 14-1 and 14-2 and the adhesive 15 are thesame and additionally are the largest next to the solid-state imagingelement 11, and the outline shape of the glass substrate 12 is thesmallest.

In addition, as depicted in the lower left portion in FIG. 31 , theside-surface cross-section may be formed such that the descending orderin terms of the sizes of the horizontal outline shapes is thesolid-state imaging element 11, the IRCFs 14-1 and 14-2, the adhesive15, and the glass substrate 12.

In addition, as depicted in the lower right portion in FIG. 31 , theside-surface cross-section may be formed such that the horizontaloutline shape of the solid-state imaging element 11 is the largest, theoutline shape of the glass substrate 12 is the second largest, and theoutline shapes of the IRCFs 14-1 and 14-2 and the adhesive 15 are thesame and additionally are the smallest.

<Dicing Method for Upper Left Portion in FIG. 31 >

Next, a dicing method for the upper left portion in FIG. 31 is explainedwith reference to FIG. 32 .

The upper row in FIG. 32 depicts a figure for explaining theside-surface cross-section depicted in the upper left portion in FIG. 31. That is, the upper row in FIG. 32 depicts the side-surfacecross-section in which the horizontal outline shape of the solid-stateimaging element 11 is the largest, the outline shapes of all of theglass substrate 12, the IRCFs 14-1 and 14-2, and the adhesive 15 are thesame, are the second largest and smaller than the horizontal outlineshape of the solid-state imaging element 11.

Here, a method of forming the side-surface cross-section depicted in theupper left portion in FIG. 31 is explained with reference to the centralrow in FIG. 32 . Note that the central row in FIG. 32 is an enlargedview of the boundary between adjacent solid-state imaging elements 11 tobe cut by dicing as seen from the side surface.

At a first step, an area Zb which is at the boundary between theadjacent solid-state imaging elements 11, and includes the glasssubstrate 12, the IRCFs 14-1 and 14-2, and the adhesive 15 is cut to adepth Lc1 from the surface layer of the IRCF 14-1 by using a bladehaving a predetermined width Wb (e.g. approximately 100 μm).

Here, whereas, in the central portion in FIG. 32 , the position at adepth Lc from the surface layer of the IRCF 14-1 is in the surface layerof the solid-state imaging element 11, and is a position that reaches awiring layer 11M formed by a CuCu junction or the like, it is sufficientif the position at the depth Lc reaches the surface layer of thesolid-state imaging element 11. Accordingly, the depth Lc1 may be such adepth that a portion extending to the surface layer of the semiconductorsubstrate 81 in FIG. 6 is cut.

In addition, as depicted in the central portion in FIG. 32 , the bladecuts the boundary in a state that the center of the blade is alignedwith the central position of the adjacent solid-state imaging elements11 represented by a dash-dotted line. In addition, in the figure, awidth WLA is a width over which a wiring layer formed at the endsections of the two adjacent solid-state imaging elements 11 is formed.Furthermore, a width of one of the chips of the solid-state imagingelements 11 extending to the center of a scribe line is a width Wc, anda width of one of the chips of the solid-state imaging elements 11extending to the end section of the glass substrate 12 is a width Wg.

Furthermore, the area Zb corresponds to the shape of the blade, theupper portion has the blade width Wb, and the lower portion is expressedby a semi-spherical shape. These correspond to the blade shape.

At a second step, for example, an area Zh which is in the Si substrate(the semiconductor substrate 81 in FIG. 6 ) of the solid-state imagingelement 11, and has a predetermined width Wd (e.g. approximately 35 μm)smaller than the width of the blade used for cutting the glass substrate12 is cut by dry etching, laser dicing, or a blade, and thereby thesolid-state imaging elements 11 are diced. It should be noted that thewidth Wd becomes approximately zero in the case of laser dicing. Inaddition, the cutting shape can be adjusted to a desired shape by dryetching, laser dicing, or a blade.

As a result, as depicted on the lower row in FIG. 32 , the side-surfacecross-section is formed such that the horizontal outline shape of thesolid-state imaging element 11 is the largest, and the outline shapes ofall of the glass substrate 12, the IRCFs 14-1 and 14-2, and the adhesive15 are the same and additionally are smaller than the horizontal outlineshape of the solid-state imaging element 11.

Note that, as represented by an area 2431, the lower row in FIG. 32depicts portions around the boundary of the IRCF 14-2 that faces thesolid-state imaging element 11 as having part, in the horizontaldirection, having a width which is larger than the horizontal width ofthe IRCF 14-1, and the shape of the side-surface cross-section isdifferent from the shape of the side-surface cross-section of the glasssubstrate 12, the IRCFs 14-1 and 14-2, and the adhesive 15 on the upperrow in FIG. 32 .

However, this is a result of depicting the cutting shape formed by theblade in a deformed manner, and the configuration on the lower row inFIG. 32 and the configuration on the upper row in the FIG. 32 can bemade substantially identical by adjusting the cutting shape by dryetching, laser dicing, or a blade.

In addition, the process of cutting the area Zh in the Si substrate (thesemiconductor substrate 81 in FIG. 6 ) included in the solid-stateimaging element 11 may be executed before the work of cutting the areaZb, and, at this time, the work may be executed in a vertically reversedstate relative to the state depicted in the central row in FIG. 32 .

Furthermore, because the wiring layer is prone to cracks or film peelingat the time of blade dicing, the area Zh may be cut by ablationprocessing using a short pulse laser.

<Dicing Method for Upper Right Portion in FIG. 31 >

Next, a dicing method for the upper right portion in FIG. 31 isexplained with reference to FIG. 33 .

The upper row in FIG. 33 depicts a figure for explaining theside-surface cross-section depicted in the upper right portion in FIG.31 . That is, the upper row in FIG. 33 depicts the side-surfacecross-section formed such that the horizontal outline shape of thesolid-state imaging element 11 is the largest, the outline shapes of theIRCFs 14-1 and 14-2 and the adhesive 15 are the same and additionallyare the largest next to the outline shape of the solid-state imagingelement 11, and the outline shape of the glass substrate 12 is thesmallest.

Here, a method of forming the side-surface cross-section depicted in theupper right portion in FIG. 31 is explained with reference to thecentral row in FIG. 33 . Note that the central row in FIG. 33 is anenlarged view of the boundary between adjacent solid-state imagingelements 11 to be cut by dicing as seen from the side surface.

At a first step, an area Zb1 including the glass substrate 12, the IRCFs14-1 and 14-2, and the adhesive 15 is cut to a depth Lc11 from thesurface layer of the IRCF 14-1 by using a blade having a predeterminedwidth Wb1 (e.g. approximately 100 μm).

At a second step, an area Zb2 having a depth larger than the depth ofthe wiring layer 11M is cut by using a blade having a predeterminedwidth Wb2 (<width Wb1).

At a third step, for example, an area Zh which is in the Si substrate(the semiconductor substrate 81 in FIG. 6 ), and has the predeterminedwidth Wd (e.g. approximately 35 μm) smaller than the width Wb2 is cut bydry etching, laser dicing, or a blade, and thereby the solid-stateimaging elements 11 are diced. It should be noted that the width Wdbecomes approximately zero in the case of laser dicing. In addition, thecutting shape can be adjusted to a desired shape by dry etching, laserdicing, or a blade.

As a result, as depicted on the lower row in FIG. 33 , the side-surfacecross-section is formed such that the horizontal outline shape of thesolid-state imaging element 11 is the largest, the outline shapes of theIRCFs 14-1 and 14-2 and the adhesive 15 are the same and additionallyare the largest next to the outline shape of the solid-state imagingelement 11, and the outline shape of the glass substrate 12 is thesmallest.

Note that, as represented by an area 2441, the lower row in FIG. 33depicts part, in the horizontal direction, of the IRCF 14-1 as having ahorizontal width identical to the horizontal width of the glasssubstrate 12. In addition, as represented by an area 2442, part, in thehorizontal direction, of the IRCF 14-2 is depicted as having ahorizontal width larger than the horizontal width of the IRCF 14-1.

Accordingly, the shape of the side-surface cross-section of the glasssubstrate 12, the IRCFs 14-1 and 14-2, and the adhesive 15 on the lowerrow in FIG. 33 is different from the shape on the upper row in FIG. 33 .

However, this is a result of depicting the cutting shape formed by theblade in a deformed manner, and the configuration on the lower row inFIG. 32 and the configuration on the upper row in the FIG. 32 can bemade substantially identical by adjusting the cutting shape by dryetching, laser dicing, or a blade.

In addition, the process of cutting the area Zh in the Si substrate (thesemiconductor substrate 81 in FIG. 6 ) included in the solid-stateimaging element 11 may be executed before the work of cutting the areasZb1 and Zb2, and, at this time, the work may be executed in a verticallyreversed state relative to the state depicted in the central row in FIG.33 .

Furthermore, because the wiring layer is prone to cracks or film peelingat the time of blade dicing, the area Zh may be cut by ablationprocessing using a short pulse laser.

<Dicing Method for Lower Left Portion in FIG. 31 >

Next, a dicing method for the lower left portion in FIG. 31 is explainedwith reference to FIG. 34 .

The upper row in FIG. 34 depicts a figure for explaining theside-surface cross-section depicted in the lower left portion in FIG. 31. That is, the upper row in FIG. 34 depicts the side-surfacecross-section in which the descending order in terms of the sizes of thehorizontal outline shapes is the solid-state imaging element 11, theIRCFs 14-1 and 14-2, the adhesive 15, and the glass substrate 12.

Here, a method of forming the side-surface cross-section depicted in theupper right portion in FIG. 31 is explained with reference to thecentral row in FIG. 34 . Note that the central row in FIG. 34 is anenlarged view of the boundary between adjacent solid-state imagingelements 11 to be cut by dicing as seen from the side surface.

At a first step, the area Zb including the glass substrate 12, the IRCFs14-1 and 14-2, and the adhesive 15 is cut to a depth Lc21 from thesurface layer of the IRCF 14-2 by using a blade having a predeterminedwidth Wb1 (e.g. approximately 100 μm).

At a second step, ablation processing using a laser is performed withthe predetermined width Wb2 (<width Wb1), and an area ZL is cut to adepth larger than the depth of the wiring layer 11M.

At this step, the IRCFs 14-1 and 14-2 and the adhesive 15 experiencethermal contraction due to absorption of laser light near the processedsurfaces, and thereby the adhesive 15 recedes relative to the cutsurfaces of the IRCFs 14-1 and 14-2 due to the wavelength dependence,and forms a concave shape.

At a third step, for example, an area Zh which is in the Si substrate(the semiconductor substrate 81 in FIG. 6 ), and has the predeterminedwidth Wd (e.g. approximately 35 μm) smaller than the width Wb2 is cut bydry etching, laser dicing, or a blade, and thereby the solid-stateimaging elements 11 are diced. It should be noted that the width Wdbecomes approximately zero in the case of laser dicing. In addition, thecutting shape can be adjusted to a desired shape by dry etching, laserdicing, or a blade.

As a result, as depicted on the lower row in FIG. 34 , the side-surfacecross-section is formed such that the horizontal outline shape of thesolid-state imaging element 11 is the largest, the outline shapes of theIRCFs 14-1 and 14-2 are the second largest, furthermore the outlineshape of the adhesive 15 is the third largest, and the outline shape ofthe glass substrate 12 is the smallest. That is, as represented by anarea Z452 on the lower row in FIG. 34 , the outline shape of theadhesive 15 is smaller than the outline shapes of the IRCFs 14-1 and14-2.

Note that, as represented by an area 2453, the lower row in FIG. 34depicts part, in the horizontal direction, of the IRCF 14-2 as having ahorizontal width larger than the horizontal width of the IRCF 14-1. Inaddition, as represented by an area 2451, part, in the horizontaldirection, of the IRCF 14-1 is depicted as having a horizontal widthidentical to the horizontal width of the glass substrate 12.

Accordingly, the shape of the side-surface cross-section of the glasssubstrate 12, the IRCFs 14-1 and 14-2, and the adhesive 15 on the lowerrow in FIG. 34 is different from the shape on the upper row in FIG. 34 .

However, this is a result of depicting the cutting shape formed by theblade in a deformed manner, and the configuration on the lower row inFIG. 32 and the configuration on the upper row in the FIG. 32 can bemade substantially identical by adjusting the cutting shape by dryetching, laser dicing, or a blade.

In addition, the process of cutting the area Zh in the Si substrate (thesemiconductor substrate 81 in FIG. 6 ) included in the solid-stateimaging element 11 may be executed before the work of cutting the areasZb and ZL, and, at this time, the work may be executed in a verticallyreversed state relative to the state depicted in the central row in FIG.34 .

Furthermore, because the wiring layer is prone to cracks or film peelingat the time of blade dicing, the area Zh may be cut by ablationprocessing using a short pulse laser.

<Dicing Method for Lower Right Portion in FIG. 31 >

Next, a dicing method for the lower right portion in FIG. 31 isexplained with reference to FIG. 35 .

The upper row in FIG. 35 depicts a figure for explaining theside-surface cross-section depicted in the lower right portion in FIG.31 . That is, the upper row in FIG. 35 depicts the side-surfacecross-section in which the horizontal outline shape of the solid-stateimaging element 11 is the largest, the outline shape of the glasssubstrate 12 is the second largest, and the outline shapes of the IRCFs14-1 and 14-2 and the adhesive 15 are the same and additionally are thesmallest.

Here, a method of forming the side-surface cross-section depicted in thelower right portion in FIG. 31 is explained with reference to thecentral row in FIG. 35 . Note that the central row in FIG. 35 is anenlarged view of the boundary between adjacent solid-state imagingelements 11 to be cut by dicing as seen from the side surface.

At a first step, an area Zs1 which is in the glass substrate 12, and hasa width Ld which is substantially almost zero is cut by generally-calledstealth (laser) dicing processing using a laser.

At a second step, ablation processing using a laser is performed with apredetermined width Wab, and the area ZL which is in the IRCFs 14-1 and14-2 and the solid-state imaging element 11, and has a depth larger thanthe depth of the wiring layer 11M is cut.

At this step, the IRCFs 14-1 and 14-2 and the adhesive 15 are processedsuch that the cut surfaces thereof become identical by adjusting theablation processing using the laser.

At a third step, an area Zs2 having a width which is approximately zerois cut by generally-called stealth (laser) dicing processing using alaser, and the solid-state imaging elements 11 are diced. At this time,organic objects generated by the ablation are discharged to the outsidevia grooves formed by the stealth dicing processing.

As a result, as represented by areas 2461 and 2462 on the lower row inFIG. 35 , the side-surface cross-section is formed such that thehorizontal outline shape of the solid-state imaging element 11 is thelargest, the outline shape of the glass substrate 12 is the secondlargest, and the outline shapes of the IRCFs 14-1 and 14-2 and theadhesive 15 are the same and additionally are the smallest.

In addition, the order of the stealth dicing processing on the glasssubstrate 12 and the stealth dicing processing on the solid-stateimaging element 11 may be reversed, and, at this time, the work may beperformed in a vertically reversed state relative to the state depictedin the central row in FIG. 35 .

<Addition of Anti-Reflection Film>

Whereas, as depicted in the upper left portion in FIG. 36 , the IRCFs14-1 and 14-2 are formed on the solid-state imaging element 11 byadhesion by using the adhesive 15, and furthermore the glass substrate12 is formed on the IRCF 14-1 to reduce occurrence of burrs and also toreduce deterioration of the optical characteristics in the exampleexplained thus far, furthermore, an additional film having ananti-reflection function may be formed.

That is, for example, as depicted in the central left portion in FIG. 36, an additional film 371 having an anti-reflection function may beformed on the glass substrate 12.

In addition, for example, as depicted in the lower left portion in FIG.36 , additional films 371-1 to 371-4 having anti-reflection functionsmay be formed on the glass substrate 12, at the boundary between theglass substrate 12 and the IRCF 14-1, at the boundary between the IRCF14-1 and the adhesive 15, and at the boundary between the adhesive 15and the IRCF 14-2, respectively.

In addition, as depicted in each of the upper right portion, centralright portion, and lower right portion in FIG. 36 , any one of theadditional films 371-2, 371-4, and 371-3 having anti-reflectionfunctions may be formed, and a combination of these may be formed.

Note that the additional films 371 and 371-1 to 371-4 may be formed toinclude films having functions corresponding to, for example, the ARcoat 271 a or anti-reflection treatment section (moss eye) 291 amentioned above.

These additional films 371 and 371-1 to 371-4 prevent entrance ofunnecessary light, and reduce occurrence of ghosts and flares.

<Addition to Side-Surface Section>

Whereas the additional films 371-1 to 371-4 having anti-reflectionfunctions are formed on the glass substrate 12, at the boundary betweenthe glass substrate 12 and the IRCF 14-1, at the boundary between theIRCF 14-1 and the adhesive 15, and at the boundary between the adhesive15 and the IRCF 14-2, respectively, in the examples explained thus far,an additional film that functions as an anti-reflection film or a lightabsorption film may be formed at the side-surface section.

That is, as depicted in the left portion in FIG. 37 , an additional film381 that functions as an anti-reflection film, a light absorption film,or the like may be formed on the entire side-surface cross-section ofthe glass substrate 12, the IRCFs 14-1 and 14-2, the adhesive 15, andthe solid-state imaging element 11.

In addition, as depicted in the right portion in FIG. 37 , theadditional film 381 that functions as an anti-reflection film, a lightabsorption film, or the like may be formed only on the side surface ofthe glass substrate 12, the IRCFs 14-1 and 14-2, and the adhesive 15,excluding the side surface of the solid-state imaging element 11.

In either case, by providing the additional film 381 at the side-surfacesection of the solid-state imaging element 11, the glass substrate 12,the IRCFs 14-1 and 14-2, and the adhesive 15, entrance of unnecessarylight to the solid-state imaging element 11 is prevented, and occurrenceof ghosts and flares is reduced.

17. Seventeenth Embodiment

Whereas dropped garbage is reduced, and also occurrence of flares andghosts is reduced by adjusting the relation of the horizontal sizes ofthe solid-state imaging element 11, IRCF 14-1, adhesive 15, IRCF 14-2,and glass substrate 12 that are stacked on one another in the examplesexplained thus far, a lens which is small-sized and lightweight, andadditionally capable of high-resolution imaging may be realized bydefining the shape of the lens.

For example, in the case to be considered next, the glass substrate 12is formed on the solid-state imaging element 11, and a lenscorresponding to the lens 271 having the AR coat 271 a formed thereon isjoined on the glass substrate 12 (e.g. the integrated configurationsection 10 in the imaging apparatus 1 in FIG. 19 ). Note that theconfiguration of the imaging apparatus 1 may be different from theconfiguration in FIG. 19 , and, for example, the same is true also ifthe lens 131 in the integrated configuration section 10 in the imagingapparatus 1 in FIG. 9 is replaced with the lens 271.

That is, it is supposed, as depicted in FIG. 38 , that a concave lens401 (corresponding to the lens 271 in FIG. 19 ) having an asphericalsurface concentrically about the position of the center of gravity seenfrom above is formed on the glass substrate 12 on the solid-stateimaging element 11. In addition, it is supposed that an AR coat 402 (afilm having a function corresponding to the AR coat 271 a oranti-reflection treatment section 291 a mentioned above) is formed onthe light incidence surface of the lens 401, and a protrusion 401 a isformed on the outer circumferential section. Note that FIG. 38 and FIG.39 depict a configuration including only the solid-state imaging element11, the glass substrate 12, and the lens 271 which are selected from theintegrated configuration section 10 in the imaging apparatus 1 in FIG.19 .

Here, the lens 401 is given a mortar shape having a concave shape whichhas an aspherical surface having its center at the position of thecenter of gravity as seen from above as depicted in FIG. 39 . Note that,in FIG. 39 , the upper right portion in the figure depicts across-sectional shape of the lens 401 taken in a direction representedby a dotted line in the upper left portion in the figure, and the lowerright portion in the figure depicts a cross-sectional shape of the lens401 taken in a direction represented by a solid line in the upper leftportion in the figure.

In FIG. 39 , an area Ze of the lens 401 has a structure having anaspherical curved surface common to the upper right portion and thelower right portion in FIG. 39 , and such a shape is included in aneffective region that condenses incident light from above in the figureonto the imaging surface of the solid-state imaging element 11.

In addition, because the lens 401 includes the aspherical curvedsurface, the thickness changes according to distances from the centralposition in a direction vertical to the direction of incidence of light.More specifically, the lens thickness is the smallest thickness D at thecentral position, and the lens thickness at a position which is in thearea Ze, and farthest from the center is the largest thickness H. Inaddition, in a case where the thickness of the glass substrate 12 is athickness Th, the largest thickness H of the lens 401 is larger than thethickness Th of the glass substrate 12, and the smallest thickness D ofthe lens 401 is smaller than the thickness Th of the glass substrate 12.

That is, summarizing these relations, by using the lens 401 and theglass substrate 12 that satisfy the relation between the thicknesses D,H, and Th of (thickness H)>(thickness Th)>(thickness D), it becomespossible to realize (the integrated configuration section 10 of) theimaging apparatus 1 that is small-sized and lightweight, andadditionally capable of high-resolution imaging.

In addition, by making a volume VG of the glass substrate 12 smallerthan a volume VL of the lens 401, it becomes possible to form the volumeof the lens most efficiently, and so it becomes possible to realize theimaging apparatus 1 that is small-sized and lightweight, andadditionally capable of high-resolution imaging.

<Distributions of Stresses Generated at Time of Heating of AR Coat>

In addition, according to the configuration like the one above, stressesdue to expansion or contraction of the AR coat 402 at the time ofimplementation reflow heat load or at the time of a reliability test canbe reduced.

FIG. 40 depicts distributions of stresses due to expansion orcontraction of the AR coat 402 at the time of implementation reflow heatload about different outline shapes of the lens 401 in FIG. 39 . Notethat the stress distributions in FIG. 40 are distributions in an areawhich is ½ in both the horizontal direction and the vertical directionrelative to the central position of the lens 401 depicted in an area Zpdepicted in FIG. 38 , and are distributions in an area which is ¼ of thewhole.

The leftmost example in FIG. 40 depicts the distribution of stressesgenerated, at the time of implementation reflow heat load, to an AR coat402A in a lens 401A not provided with the protrusion 401 a.

The second example from left in FIG. 40 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402B in a lens 401B provided with the protrusion 401 adepicted in FIG. 39 .

The third example from left in FIG. 40 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402C in a lens 401C having the protrusion 401 a that isdepicted in FIG. 39 , and has a height which is taller than in the casedepicted in FIG. 39 .

The fourth example from left in FIG. 40 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402D in a lens 401D having the protrusion 401 a that isdepicted in FIG. 39 , and has a width which is larger than in the casedepicted in FIG. 39 .

The fifth example from left in FIG. 40 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402E in a lens 401E having the protrusion 401 a that isdepicted in FIG. 39 , and includes a tapered shape provided on the outercircumferential section and more inclined than in the case depicted inFIG. 39 .

The rightmost portion in FIG. 40 depicts the distribution of stressesgenerated, at the time of implementation reflow heat load, to an AR coat402F in a lens 401F provided with the protrusion 401 a depicted in FIG.39 only at the four sides included in the outer circumferential sectionof the lens 401F.

As depicted in FIG. 40 , in the distribution of stresses generated tothe AR coat 402A of the lens 401A without the protrusion 401 a depictedin the leftmost portion, larger stresses appear on the outercircumferential side of the effective region, but in the distribution ofstresses generated to the AR coats 402B to 402F of the lenses 401B to401F having the protrusion 401 a formed thereon, there are no largestresses like those observed in the case of the AR coat 402A.

That is, by providing the protrusion 401 a on the lens 401, it becomespossible to reduce occurrence of cracks of the AR coat 402 due toexpansion or contraction of the lens 401 at the time of implementationreflow heat load.

Modification Examples of Lens Shape

In the example explained thus far, the concave lens 401 including theprotrusion 401 a provided with a tapered shape at the outercircumferential section as depicted in FIG. 39 is included in theimaging apparatus 1 that is small-sized and lightweight, andadditionally capable of high-resolution imaging. However, as long as thelens 401 and the glass substrate 12 satisfy the relation between thethicknesses D, H, and Th of (thickness H)>(thickness Th)>(thickness D),the shape of the lens 401 may be another shape. In addition, it is morepreferable if the volumes VG and VL satisfy the relation of (volumeVG)<(volume VL).

For example, as represented by a lens 401G in FIG. 41 , as aconfiguration in which the side surface on the outer circumferentialside relative to the protrusion 401 a is at a right angle to the glasssubstrate 12, a configuration not including a tapered shape may beadopted.

In addition, as represented by a lens 401H in FIG. 41 , the side surfaceon the outer circumferential side relative to the protrusion 401 a mayhave a configuration including a rounded tapered shape.

Furthermore, as represented by a lens 401I in FIG. 41 , a configurationnot including the protrusion 401 a itself, but having a side surfaceincluding a linear tapered shape that forms a predetermined angle withthe glass substrate 12 may be adopted.

In addition, as represented by a lens 401J in FIG. 41 , as aconfiguration not including the protrusion 401 a itself, but having aside surface that forms a right angle with the glass substrate 12, aconfiguration not including a tapered shape may be adopted.

Furthermore, as represented by a lens 401K in FIG. 41 , a configurationnot including the protrusion 401 a itself, but having a side surfaceincluding a rounded tapered shape relative to the glass substrate 12 maybe adopted.

In addition, as represented by a lens 401L in FIG. 41 , a two-stepconfiguration not including the protrusion 401 a itself, but having alens side surface having two inflection points may be adopted. Note thatthe specific configuration of the lens 401L is mentioned later withreference to FIG. 42 . In addition, because the side surface of the lens401L has a two-step configuration having two inflection points, the lens401L is referred to also as a two-step side-surface lens in explanationsbelow.

Furthermore, as represented by a lens 401M in FIG. 41 , a two-stepconfiguration having a side surface including the protrusion 401 a, andadditionally having an outline side surface including two inflectionpoints may be adopted.

In addition, as represented by a lens 401N in FIG. 41 , a configurationincluding the protrusion 401 a and having a side surface which is at aright angle to the glass substrate 12 may further have a rectangularskirt section 401 b additionally near the boundary that faces the glasssubstrate 12.

Furthermore, as represented by a lens 401N in FIG. 41 , a configurationincluding the protrusion 401 a and forming a right angle with the glasssubstrate 12 may further have a rounded skirt section 401 b′additionally near the boundary that faces the glass substrate 12.

<Specific Configuration of Two-Step Side-Surface Lens>

Here, the specific configuration of the two-step side-surface lens 401Lin FIG. 41 is explained with reference to FIG. 42 .

FIG. 42 depicts external appearance perspective views as seen fromvarious directions when the glass substrate 12 is formed on thesolid-state imaging element 11, and the two-step side-surface lens 401Lis provided on the glass substrate 12. Here, in the central upperportion in FIG. 42 , sides LA, LB, LC, and LD are set clockwise startingfrom the right side of the solid-state imaging element 11 in the figure.

Then, the right portion in the FIG. 42 depicts a perspective view ofportions around angled sections of the sides LA and LB of thesolid-state imaging element 11 when the solid-state imaging element 11and the lens 401L are seen in the direction of a line of sight E1 in thecentral upper portion in FIG. 42 . In addition, the central lowerportion in the FIG. 42 depicts a perspective view of portions aroundangled sections of the sides LA and LB of the solid-state imagingelement 11 when the solid-state imaging element 11 and the lens 401L areseen in the direction of a line of sight E2 in the central upper portionin FIG. 42 . Furthermore, the left portion in the FIG. 42 depicts aperspective view of portions around angled sections of the sides LB andLC of the solid-state imaging element 11 when the solid-state imagingelement 11 and the lens 401L are seen in the direction of a line ofsight E3 in the central portion in FIG. 42 .

That is, because, when the two-step side-surface lens 401L as a concavelens is seen from above, the central sections of the sides LB and LD(not depicted), which are longer sides of the two-step side-surface lens401L, are at positions close to the position of the center of gravity ofa circular shape that functions as a lens having the smallest lensthickness, the lens thickness is small at those positions, and thecentral sections of the sides LB and LD have ridge lines having gentlycurved shapes as represented by dotted lines surrounding the centralsections.

In contrast to this, the central sections of the sides LA and LC, whichare shorter sides, are at positions far from the position of the centerof gravity, so the lens thickness is large at those positions, andthereby the central sections of the sides LA and LC have ridge lineshaving linear shapes.

<Two Inflection Points and Two-Step Side Surface>

In addition, as depicted in FIG. 43 , the two-step side-surface lens401L has a cross-sectional shape in which the side surface of thenon-effective region provided on the outer side of an effective regionZe has a two-step configuration, average surfaces X1 and X2 of the sidesurface are formed to be not flush with each other, and inflectionpoints P1 and P2 in the cross-sectional shape are formed at positionswhere steps are formed on the two-step side surface.

The inflection points P1 and P2 appear as a concave corner and a convexcorner in this order starting from the position closer to thesolid-state imaging element 11.

In addition, the heights of both the inflection points P1 and P2 fromthe glass substrate 12 are larger than the smallest thickness Th of thetwo-step side-surface lens 401L.

Furthermore, it is desirable if the difference between the averagesurfaces X1 and X2 of the two-step side surface (the distance betweenthe average surfaces X1 and X2) is larger than the thickness of thesolid-state imaging element 11 (the thickness of the silicon substrate81 of the solid-state imaging element 11 in FIG. 6 ).

In addition, it is desirable if the distance difference between theaverage surfaces X1 and X2 of the two-step side surface is equal to orlarger than 1% of a region width (e.g. the horizontal width He or thevertical height Ve in FIG. 23 ) of the effective region of the lens 401Lvertical to the direction of incidence of light.

Accordingly, as long as a two-step side surface and two inflectionpoints that satisfy the conditions mentioned above are formed, a shapeother than the shape of the two-step side-surface lens 401L may beadopted. For example, as depicted on the second row from top in FIG. 43, a two-step side-surface lens 401P provided with a two-step sidesurface including average surfaces X11 and X12, and having inflectionpoints P11 and P12 that are formed at positions higher than the positionof the smallest thickness Th of the lens from the glass substrate 12,and have curvatures different from the curvatures of the inflectionpoints P1 and P2 may be adopted.

In addition, for example, as depicted on the third row from top in FIG.43 , a two-step side-surface lens 401Q provided with a two-step sidesurface including average surfaces X21 and X22, and having inflectionpoints P21 and P22 that are formed at positions higher than the positionof the smallest thickness Th of the lens from the glass substrate 12,and have curvatures different from the curvatures of the inflectionpoints P1 and P2, and P11 and P22 may be adopted.

Furthermore, for example, as depicted on the fourth row from top in FIG.43 , a two-step side-surface lens 401R provided with a two-step sidesurface including average surfaces X31 and X32, having inflection pointsP31 and P32 formed at positions higher than the position of the smallestthickness Th of the lens from the glass substrate 12, and having roundedshapes at the end section of the lens 401 at positions where the lens401 has the largest thickness may be adopted.

<Distributions of Stresses Generated at Time of Heating of AR Coat inLens Including Two Inflection Points and Two-Step Configuration SideSurface>

As mentioned above, in the case of the two-step side-surface lens 401Lincluding two inflection points and a two-step configuration sidesurface, stresses applied to the AR coat 402 due to expansion orcontraction of the lens 401L at the time of implementation reflow heatload or at the time of a reliability test can be reduced.

FIG. 44 depicts distributions of stresses due to expansion orcontraction of the AR coat 402 at the time of implementation reflow heatload about different outline shapes of the lens 401 in FIG. 39 . In FIG.44 , the upper row depicts stress distributions of the AR coat 402 onthe farther side as seen in a diagonal direction of the lens 401, andthe lower row depicts stress distributions of the AR coat 402 on thenearer side as seen in the diagonal direction of the lens 401.

The leftmost example in FIG. 44 depicts the distribution of stressesgenerated, at the time of implementation reflow heat load, to an AR coat402S in a lens 401S (corresponding to the lens 401A) which is notprovided with the protrusion 401 a, and is not a two-step side-surfacelens.

The second example from left in FIG. 44 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402T in a lens 401T corresponding to the two-stepside-surface lens 401L depicted in FIG. 43 .

The third example from left in FIG. 44 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402U in a lens 401U not provided with the protrusion 401 a,but provided with a tapered shape, and additionally having angledsections at the sides of the lens that are shaped in rounded shapes.

The fourth example from left in FIG. 44 depicts the distribution ofstresses generated, at the time of implementation reflow heat load, toan AR coat 402V in a lens 401V provided with neither the protrusion 401a nor a tapered shape, but having a side surface vertical to the glasssubstrate 12, and additionally having angled sections of the sides ofthe lens that are shaped in rounded shapes.

In addition, FIG. 45 depicts graphs of the overall maximum value(Worst), the maximum value in the effective region of the lens(Effective), and the maximum value at the ridge line (Ridge line) in thedistributions of stresses generated to the AR coat about each lens shapein FIG. 44 , in this order from left. In addition, the graphs of themaximum values in FIG. 45 represent the maximum values of the stressdistributions of the AR coats 402S to 402V, in this order from left.

As depicted in FIG. 45 , the overall maximum stresses of the lenses are1390 MPa at an angled section Ws (FIG. 44 ) on the top surface in thecase of the AR coat 402S of the lens 401S, 1130 MPa at an angled sectionWt (FIG. 44 ) on the ridge line in the case of the AR coat 402T of thelens 401T, 800 MPa at Wu (FIG. 44 ) on the ridge line in the case of theAR coat 402U of the lens 401U, and 1230 MPa at Wv (FIG. 44 ) on theridge line in the case of the AR coat 402V of the lens 401V.

In addition, as depicted in FIG. 45 , the maximum stresses of theeffective regions of the lenses are 646 MPa in the case of the AR coat402S of the lens 401S, 588 MPa in the case of the AR coat 402T of thelens 401T, 690 MPa in the case of the AR coat 402U of the lens 401U, and656 MPa in the case of the AR coat 402V of the lens 401V.

Furthermore, the maximum stresses of the ridge lines of the lenses are1050 MPa in the case of the AR coat 402S of the lens 401S, 950 MPa inthe case of the AR coat 402T of the lens 401T, 800 MPa in the case ofthe AR coat 402U of the lens 401U, and 1230 MPa in the case of the ARcoat 402U of the lens 401V.

According to FIG. 45 , in any of the graphs, the maximum stresses becomethe smallest in the case of the AR coat 402S of the lens 401S. However,according to FIG. 44 , stresses which are present in a large amount inareas close to the outer circumferential section of the AR coat 402U ofthe lens 401U, the stress being around 600 MPa, are not distributed inthe overall stress distribution of the effective region of the AR coat402T of the lens 401T, and it can be known that, as a whole, stressesgenerated to the AR coat 402T of the AR coat 402T (identical to an ARcoat 402L) become small in an outline shape including the AR coat 402Tof the lens 401T (identical to the lens 401L).

That is, it can be known that, according to FIG. 44 and FIG. 45 , at thetime of implementation reflow heat load, expansion or contractiongenerated to the AR coat 402T (402L) of the lens 401T (401L) includingtwo inflection points and two-step configuration side surface arereduced, and stresses generated resulting from expansion or contractionare reduced.

As mentioned above, by adopting the two-step side-surface lens 401Lincluding two inflection points and two-step configuration side surfaceas the lens 401, it becomes possible to reduce expansion or contractiondue to heat at the time of implementation reflow heat load, areliability test, or the like.

As a result, it becomes possible to reduce stresses generated to the ARcoat 402L, and it becomes possible to reduce generation of cracks andgeneration of peeling of the lens or the like. In addition, because itbecomes possible to reduce expansion or contraction of the lens itself,it becomes possible to reduce occurrence of distortions, to reduce imagequality deterioration due to an increase of double refraction resultingfrom distortions, and to reduce occurrence of flares due to an increaseof interfacial reflection generated by local changes of the refractiveindex.

18. Eighteenth Embodiment

Whereas a lens which is small-sized and lightweight, and additionallycapable of high-resolution imaging is realized by defining the shape ofthe lens in the examples explained thus far, a lens which is moresmall-sized and lightweight, and additionally capable of capturinghigh-resolution images may be realized by enhancing the reliability offormation of the lens in the solid-state imaging element 11.

As depicted in the upper portion in FIG. 46 , in a state that a shapingmold 452 on a substrate 451 is pressed against the glass substrate 12 onthe solid-state imaging element 11, the space between the shaping mold452 and the glass substrate 12 is filled with an ultraviolet lightcuring resin 461 which is to be the material of the lens 401, and theultraviolet light curing resin 461 is exposed to ultraviolet light fromthe upper portion in the figure for predetermined time.

Both the substrate 451 and the shaping mold 452 include materials thattransmit ultraviolet light.

The shaping mold 452 has a convex structure which has an asphericalsurface corresponding to the shape of the concave lens 401, the outercircumferential section of the shaping mold 452 has a light blockingfilm 453 formed thereon, and a tapered shape can be formed on the sidesurface of the lens 401 having an angle θ as depicted in FIG. 46 , forexample, according to the angle of incidence of ultraviolet light.

By being exposed to ultraviolet light for predetermined time, theultraviolet light curing resin 461 to be the material of the lens 401 iscured, and, as depicted in the lower portion in FIG. 46 , formed as aconcave lens having an aspherical surface, and also pasted onto theglass substrate 12.

After an elapse of the predetermined time in a state that theultraviolet light curing resin 461 is irradiated with the ultravioletlight, the ultraviolet light curing resin 461 is cured to thereby formthe lens 401, and after the formation of the lens 401, the shaping mold452 is removed from the formed lens 401 (mold release).

At the boundary between the outer circumferential section of the lens401 and the glass substrate 12, part of the ultraviolet light curingresin 461 effuses from the shaping mold 452, and an effusion section 461a is generated. However, because ultraviolet light advancing toward theeffusion section 461 a is blocked by the light blocking film 453, partof the effusion section 461 a of the ultraviolet light curing resin 461is left uncured as represented by an area Zc in an enlarged view Zf, andafter the mold is released, the part of the effusion section 461 a iscured by ultraviolet light included in natural light, and so is left asa skirt section 401 d.

Thereby, the lens 401 is formed as a concave lens by the shaping mold452, and also a tapered shape is formed on the side surface at the angleθ defined by the light blocking film 453. In addition, because the skirtsection 401 d is formed at the boundary of the outer circumferentialsection of the lens 401 that faces the glass substrate 12, it becomespossible to more rigidly adhere the lens 401 to the glass substrate 12.

As a result, it becomes possible to form, highly reliably, a lens whichis small-sized and lightweight, and additionally capable of capturinghigh-resolution images.

Note that, in the example explained thus far, as depicted in the upperleft portion in FIG. 47 , the light blocking film 453 is provided at theouter circumferential section of the lens 401 on the backside (the lowerside in the figure) of the substrate 451 in terms of the direction ofincidence of ultraviolet light. However, as depicted in the upper rightportion in FIG. 47 , the light blocking film 453 may be provided at theouter circumferential section of the lens 401 on the front side (theupper side in the figure) of the substrate 451 in terms of the directionof incidence of ultraviolet light.

In addition, as depicted in the second example from top in the leftcolumn in FIG. 47 , instead of the substrate 451, a shaping mold 452′which is larger in the horizontal direction than the shaping mold 452may be formed, and the light blocking film 453 may be provided at theouter circumferential section of the lens 401 on the backside (the lowerside in the figure) in terms of the direction of incidence ofultraviolet light.

Furthermore, as depicted in the second example from top in the rightcolumn in FIG. 47 , the light blocking film 453 may be provided at theouter circumferential section of the lens 401 on the front side (theupper side in the figure) of the substrate 451 of the shaping mold 452′in terms of the direction of incidence of ultraviolet light.

In addition, as depicted in the third example from top in the leftcolumn in FIG. 47 , a shaping mold 452″ may be formed by integrating thesubstrate 451 and the shaping mold 452, and the light blocking film 453may be provided at the outer circumferential section of the lens 401 onthe backside (the lower side in the figure) in terms of the direction ofincidence of ultraviolet light.

Furthermore, as depicted in the third example from top in the rightcolumn in FIG. 47 , the shaping mold 452″ may be formed by integratingthe substrate 451 and the shaping mold 452, and the light blocking film453 may be provided at the outer circumferential section of the lens 401on the front side (the upper side in the figure) in terms of thedirection of incidence of ultraviolet light.

In addition, as depicted in the lower left portion in FIG. 47 , ashaping mold 452′″ provided with a configuration to define part of theside-surface section may be formed in addition to the substrate 451 andthe shaping mold 452, and the light blocking film 453 may be formed atthe outer circumferential section of the shaping mold 452′″, and on thebackside in terms of the direction of incidence of ultraviolet light.

Note that whereas the configurations in FIG. 46 and FIG. 47 areconfigurations in which the IRCF 14 and the adhesive 15 in theintegrated configuration section 10 of the imaging apparatus 1 in FIG. 9are omitted, the IRCF 14 and the adhesive 15 are omitted only forconvenience of the explanation, and certainly may be provided betweenthe lens 401 (131) and the glass substrate 12. In addition, inexplanations below also, configurations that are different from theconfiguration of the imaging apparatus 1 in FIG. 9 in that the IRCF 14and the adhesive 15 are omitted are explained as examples, but in any ofthe configurations, the IRCF 14 and the adhesive 15 may be providedbetween the lens 401 (131) and the glass substrate 12, for example.

<Method of Forming Two-Step Side-Surface Lens>

Next, a method of manufacturing a two-step side-surface lens isexplained.

The manufacturing method is basically similar to the method ofmanufacturing the lens mentioned above which is not a two-stepside-surface type lens.

That is, as depicted in the left portion in FIG. 48 , the shaping mold452 corresponding to the side surface shape of the two-step side-surfacelens 401L is prepared on the substrate 451, and the ultraviolet lightcuring resin 461 is placed on the glass substrate 12 on the solid-stateimaging element 11. Note that the configuration of only the right halfof the side-surface cross-section of the shaping mold 452 is depicted inFIG. 48 .

Next, as depicted in the central portion in FIG. 48 , by fixing theultraviolet light curing resin 461 on which the shaping mold 452 isplaced to the glass substrate 12 by pressing the ultraviolet lightcuring resin 461 against the glass substrate 12, the concavity of theshaping mold 452 is filled with the ultraviolet light curing resin 461,and the ultraviolet light curing resin 461 is irradiated withultraviolet light for predetermined time from above in the figure.

By being exposed to the ultraviolet light, the ultraviolet light curingresin 461 is cured, and the concave two-step side-surface lens 401corresponding to the shaping mold 452 is formed.

After the lens 401 is formed due to the exposure to the ultravioletlight for the predetermined time, as depicted in the right portion inFIG. 48 , the shaping mold 452 is released, and then the lens 401including the two-step side-surface lens is completed.

In addition, as depicted in the left portion in FIG. 49 , part that isat the outer circumferential section of the shaping mold 452, is to abuton the glass substrate 12, and, for example, is lower than the height ofan inflection point which is one of two inflection points in thecross-sectional shape of the side surface, and is at a position closerto the glass substrate 12 may be cut, and the light blocking film 453may be provided at the cut surface.

In this case, as depicted in the second example from left in FIG. 49 ,when the ultraviolet light curing resin 461 is irradiated withultraviolet light for predetermined time from above in the figure in astate that the concavity of the shaping mold 452 is filled with theultraviolet light curing resin 461, the ultraviolet light is blocked ona lower section of the light blocking film 453, thereby the curing doesnot proceed, and the lens 401 remains incomplete. However, the curing ofthe ultraviolet light curing resin 461 around the effective region inthe figure exposed to the ultraviolet light proceeds, and theultraviolet light curing resin 461 is formed as the lens 401.

When the shaping mold 452 is released in this state, as depicted in thethird example from left in FIG. 49 , the side surface of a portion whichis on the two-step configuration side surface at the outermostcircumference of the lens 401 formed as the two-step side-surface lens,and is close to the glass substrate 12 is left as the effusion section461 a of the ultraviolet light curing resin 461 which is uncured.

In view of this, as depicted in the right portion in FIG. 49 , for theside surface that is still the effusion section 461 a of the ultravioletlight curing resin 461 which is uncured, the angle and the surfaceroughness of the side surface are controlled, and the surface isirradiated with ultraviolet light separately such that the ultravioletlight curing resin 461 which is uncured is cured.

By doing so, as depicted on the upper row in FIG. 50 , it becomespossible to set the angles formed by the average surfaces X1 and X2 ofthe side surface of the lens 401 to different angles like angles θ1 andθ2, respectively, relative to the direction of incidence of light, forexample.

Here, by adopting a configuration in which the angle θ1 is made smallerthan the angle θ2 when the angles of the side surfaces X1 and X2 are theangles θ1 and θ2, respectively, it becomes possible to reduce occurrenceof side surface flares, and also to reduce occurrence of peeling of thecompleted lens 401 off from the glass substrate 12 at the time of moldrelease of the shaping mold 452.

In addition, it becomes possible to adopt a configuration in which thesurface roughness ρ(X1) of the side surface X1 and the surface roughnessρ(X2) of the side surface X2 are different from each other.

Here, by setting the surface roughness ρ(X1) of the side surface X1 andthe surface roughness ρ(X2) of the side surface X2 such that the surfaceroughness ρ(X1) is lower than the surface roughness ρ(X2), it becomespossible to reduce occurrence of side surface flares, and also to reduceoccurrence of peeling of the completed lens 401 off from the glasssubstrate 12 at the time of mold release of the shaping mold 452.

In addition, by adjusting the shape of the effusion section 461 a of theultraviolet light curing resin 461, it becomes possible also to form theskirt section 401 d as depicted in the lower portion in FIG. 50 .Thereby, it becomes possible to fix the lens 401 to the glass substrate12 more rigidly.

Note that adjustments regarding the angles θ1 and θ2, the surfaceroughness ρ(X1) and ρ(X2), and the formation of the skirt section 401 dcan be performed by modifying the shape of the shaping mold 452, even ina case where the light blocking film 453 explained with reference toFIG. 48 is not used. However, in a case where the shaping mold 452provided with the light blocking film 453 is used as explained withreference to FIG. 49 , the effusion section 461 a of the ultravioletlight curing resin 461 which is left as an uncured portion in initialirradiation with ultraviolet light can be adjusted afterward, and so itbecomes possible to increase the degree of freedom of adjustments of theangles θ1 and θ2, the surface roughness ρ(X1) and ρ(X2), and the skirtsection 401 d.

In either case, it becomes possible to form the lens 401 on the glasssubstrate 12 of the solid-state imaging element 11 highly reliably. Inaddition, because it becomes possible to make adjustments regarding theangles of the side surface X1 and X2, the surface roughness ρ(X1) andρ(X2), and whether or not there is the skirt section 401 d regarding thetwo-step side-surface lens 401, it becomes possible to reduce occurrenceof flares and ghosts, and also to form the lens 401 on the glasssubstrate 12 more rigidly.

19. Nineteenth Embodiment

Whereas the lens 401 is formed on the glass substrate 12 on thesolid-state imaging element 11 more reliably in a shaping method in theexamples explained thus far, the lens 401 may be formed on the glasssubstrate 12 more reliably by forming an alignment mark on the glasssubstrate 12 for forming the lens 401 at an appropriate position on theglass substrate 12, and performing positioning on the basis of thealignment mark.

That is, as depicted in FIG. 51 , the effective region Ze (correspondingto the effective region 131 a in FIG. 23 ) of the lens 401 from thecenter is provided, the non-effective region Zn (corresponding to thenon-effective region 131 b in FIG. 23 ) is provided at the outercircumferential section of the effective region Ze, furthermore a regionZg where the glass substrate 12 is exposed is provided at the outercircumferential section of the non-effective region Zn, and a region Zscwhere a scribe line is set is provided at the outermost circumferentialsection of the solid-state imaging element 11. In FIG. 51 , theprotrusion 401 a is provided in the non-effective region Zn(corresponding to the non-effective region 131 b in FIG. 23 ).

The widths of the regions have a relation of (width of effective regionZe)>(width of non-effective region Zn)>(width of region Zg where glasssubstrate 12 is exposed)>(width of region Zsc where scribe line is set).

An alignment mark 501 is formed in the region Zg on the glass substrate12 where the glass substrate 12 is exposed. Accordingly, the size of thealignment mark 501 is a size smaller than the region Zg but needs to bea size that allows recognition of the alignment mark 501 on images thatare for alignment.

The alignment mark 501 is formed at positions which are on the glasssubstrate 12, and, for example, on which angled sections of the lens 401should abut. Alignment may be performed by making an adjustment suchthat lens angled sections of the shaping mold 452 are at positions wherethe alignment mark 501 is provided, on the basis of images captured byan alignment camera.

Examples of Alignment Mark

Examples of the alignment mark 501 include alignment marks 501A to 501Kor the like as depicted in FIG. 52 , for example.

That is, the alignment marks 501A to 501C include rectangles, thealignment marks 501D and 501E include circles, the alignment marks 501Fto 5011 include polygons, and the alignment marks 501J and 501K includea plurality of linear shapes.

Examples in which Alignment Marks are Provided on Glass Substrate and toShaping Mold

In addition, black portions and gray portions in the alignment marks501A to 501K may be formed at corresponding positions at the outercircumferential portion of the lens 401 on the shaping mold 452, and theregion Zg on the glass substrate 12, respectively, and positionalalignment of the lens 401 and the glass substrate 12 may be performed bychecking whether the lens 401 and the glass substrate 12 have a mutuallycorresponding positional relation, on the basis of an image captured byan alignment camera, for example.

That is, in the case of the alignment mark 501A, as depicted in FIG. 52, in order to achieve an appropriate positional relation between thelens 401 and the shaping mold 452, an alignment mark 501′ having a grayportion including a rectangular frame is provided on the shaping mold452, and the alignment mark 501 including a rectangular section which isa black portion is formed.

Then, alignment may be adjusted by capturing images of the alignmentmark 501 on the glass substrate 12 and the alignment mark 501′ on theshaping mold 452 by using an alignment camera in the arrow direction inFIG. 53 , and adjusting the position of the shaping mold 452 such that,in the captured images, the black rectangular alignment mark 501overlaps and lies within the alignment mark 501′ including the grayrectangular frame.

In this case, whereas it is desirable if the alignment mark 501, whichis the black portion, and the alignment mark 501′, which is the grayportion, are arranged in the single field of view of a single camera,the positional relation of a plurality of cameras may be calibrated inadvance, and alignment may be performed according to a correspondence ofthe positional relation with the alignment marks 501 and 501′ providedat different positions corresponding to the plurality of cameras.

In either case, it becomes possible to position and form the lens 401 onthe glass substrate 12 of the solid-state imaging element 11 highlyreliably by using the alignment mark 501.

20. Twentieth Embodiment

Whereas the lens 401 and the glass substrate 12 on the solid-stateimaging element 11 are positioned and formed highly reliably by using analignment mark in the examples explained thus far, the sensitivity maybe enhanced, and high-resolution imaging may be realized by forming theAR coat 402 on the effective region of the lens 401.

That is, for example, as represented by a bold line on the uppermost rowin FIG. 54 , on the glass substrate 12, an AR coat 402-P1 may be formedover the entire region of a non-effective region (corresponding to thenon-effective region 131 b in FIG. 23 ) and an effective region(corresponding to the effective region 131 a in FIG. 23 ) including theside surface and planar section of the protrusion 401 a.

In addition, for example, as depicted in the second example from top inFIG. 54 , an AR coat 402-P2 may be formed only on the effective regionin the protrusion 401 a on the lens 401. By forming the AR coat 402-P2only in the region (the effective region (corresponding to the effectiveregion 131 a in FIG. 23 )) in the protrusion 401 a on the lens 401, itbecomes possible to reduce stresses caused by expansion or contractionof the lens 401 due to heat at the time of implementation reflow heatload or the like, and occurrence of cracks of the AR coat 402-P2 can bereduced.

Furthermore, for example, as depicted in the third example from top inFIG. 54 , an AR coat 402-P3 may be formed in an inner region (theeffective region (corresponding to the effective region 131 a in FIG. 23)), of the protrusion 401 a, including the planar section of theprotrusion 401 a on the lens 401. By forming the AR coat 402-P3 only inthe inner region, of the protrusion 401 a, including the protrusion 401a on the lens 401, it becomes possible to reduce stresses generated tothe AR coat 402-P3 caused by expansion or contraction of the lens 401due to heat at the time of implementation reflow heat load or the like,and occurrence of cracks can be reduced.

Furthermore, for example, as depicted in the fourth example from top inFIG. 54 , an AR coat 402-P4 is formed in the inner region (the effectiveregion (corresponding to the effective region 131 a in FIG. 23 )) of theprotrusion 401 a, in addition to part of the planar section of theprotrusion 401 a on the lens 401 and the outer circumferential section,and furthermore an AR coat 402-P5 may be formed on the glass substrate12 and in a region around the boundary of the lens 401 that faces theglass substrate 12. By forming a region where AR coats are not formed inpart of the side-surface portion of the lens 401 as in the cases of theAR coats 402-P4 and 402-P5, it becomes possible to reduce stressesgenerated to the AR coat 402-P2 caused by expansion or contraction ofthe lens 401 due to heat at the time of implementation reflow heat loador the like, and occurrence of cracks can be reduced.

FIG. 55 summarizes the distributions of stresses generated, at the timeof implementation reflow heat load, to the AR coat 402 in cases that theAR coat 402 is formed in variously different regions for the lens 401.

In FIG. 55 , the upper portion depicts the outline shapes of the lens401 and the AR coat 402 that are seen when the lens 401 is divided intotwo in the horizontal direction and the vertical direction, and thelower portion depicts the distributions of stresses generated to thecorresponding AR coat 402 at the time of implementation reflow heatload.

The left portion in FIG. 55 depicts a case that an AR coat 402AA isformed on the whole including the surrounding glass substrate 12, theside surface of the lens 401, the protrusion 401 a, and the inside ofthe protrusion 401 a.

The second example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostexample in FIG. 55 in that an AR coat is not formed on the surroundingglass substrate 12 and the side surface of the lens 401, but an AR coat402AB is formed in other regions.

The third example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostexample in FIG. 55 in that an AR coat is not formed in the region on theside surface of the lens 401, but an AR coat 402AC is formed on thesurrounding glass substrate 12, the protrusion 401 a, and the inside ofthe protrusion 401 a.

The fourth example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostexample in FIG. 55 in that an AR coat is not formed in the region on theside surface of the lens 401, the planar section of the protrusion 401a, and a region which is on the inner side of the protrusion 401 a, andextends from the flat section on the top surface of the protrusion 401 ato a predetermined width A, and an AR coat 402AD is formed in otherregions including the inside of the protrusion 401 a and the surroundingglass substrate 12. Here, the width A is 100 μm, for example.

The fifth example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostportion in FIG. 55 in that an AR coat 402AE is formed on the inner sideof the protrusion 401 a, the flat section on the top surface of theprotrusion 401 a, and a region which is on the outer side surface of theprotrusion 401 a, and extends from the flat section down to thepredetermined width A.

The sixth example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostexample in FIG. 55 in that an AR coat 402AF is formed on the inner sideof the protrusion 401 a, the flat section on the top surface of theprotrusion 401 a, and a region which is on the outer side surface of theprotrusion 401 a, and extends from the flat section down to apredetermined width 2A.

The seventh example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostexample in FIG. 55 in that an AR coat 402AG is formed on the inner sideof the protrusion 401 a, the flat section on the top surface of theprotrusion 401 a, and a region which is on the outer side surface of theprotrusion 401 a, and extends from the flat section down to apredetermined width 3A.

The eighth example from left in FIG. 55 depicts the case of aconfiguration that is different from the configuration in the leftmostexample in FIG. 55 in that an AR coat 402AH is formed on the inner sideof the protrusion 401 a, the flat section on the top surface of theprotrusion 401 a, and a region which is on the outer side surface of theprotrusion 401 a, and extends from the flat section down to apredetermined width 4A.

In any of these, in comparison with the leftmost example in FIG. 55 inwhich the AR coat 402AA is formed to cover the entire surface of thelens 401, it can be observed that stresses generated to the AR coat 402are reduced by forming the AR coat which is located on the inner side ofthe protrusion 401 a of the lens 401 such that the AR coat is notcontinuously connected with the AR coat 402 on the glass substrate 12.

As mentioned above, by forming the AR coat 402 on the lens 401, itbecomes possible to reduce occurrence of flares and ghosts, and itbecomes possible to capture images with higher resolution.

In addition, by forming the AR coat 402 such that, on the entire surfaceincluding the effective region and non-effective region of the lens 401including the protrusion 401 a, and the glass substrate 12 at the outercircumferential section of the lens 401, a region where an AR coat isnot formed is provided in at least part other than the effective regionand the glass substrate 12, it becomes possible to reduce occurrence ofcracks resulting from expansion or contraction due to heat at the timeof implementation reflow heat load, in a reliability inspection, and soon.

Note that the AR coat 402 has been explained here, another film may beadopted as long as such a film is formed on the surface of the lens 401,and, for example, the same is true of an anti-reflection film such as amoss eye, or the like.

In addition, whereas the lens includes the protrusion 401 a in theexamples explained thus far, even if the lens does not include theprotrusion 401 a, it is sufficient if, on the entire surface includingthe effective region and the non-effective region, and on the glasssubstrate 12 at the outer circumferential section of the entire surface,a region where an AR coat is not formed is provided in at least partother than the effective region and the glass substrate 12. Stateddifferently, it is sufficient if the AR coat 402 formed on the lens 401is not formed to be continuously connected with the AR coat 402 formedon the lens side and the glass substrate 12. Because of this, the lens401 may be, for example, the two-step side-surface lens 401L, andsimilar advantages can be attained if the AR coat 402 formed on the lens401 is formed to be not continuously connected with the AR coat 402formed on the lens side and the glass substrate 12.

21. Twenty-First Embodiment

In the examples explained thus far, by forming the AR coat 402 formed onthe lens 401 such that the AR coat 402 is not continuously connectedwith the AR coat 402 formed on the glass substrate 12, stressesgenerated to the AR coat 402 due to expansion or contraction resultingfrom heat at the time of implementation reflow heat load are reduced.

However, occurrence of side surface flares may be reduced by forming alight blocking film such that the light blocking film covers theprotrusion 401 a and side surface of the lens 401.

That is, as depicted on the uppermost row in FIG. 56 , a light blockingfilm 521 may be formed in the entire area on the glass substrate 12, onthe side surface of the lens 401 and to the height of the planar sectionon the top surface of the protrusion 401 a, that is, in the area otherthan the effective region.

In addition, as depicted in the second example from top in FIG. 56 , thelight blocking film 521 may be formed on the entire surface on the glasssubstrate 12, on the side surface of the lens 401 and to the planarsection on the top surface of the protrusion 401 a, that is, the entiresurface portion other than the effective region.

Furthermore, as depicted in the third example from top in FIG. 56 , thelight blocking film 521 may be formed on the glass substrate 12 and onthe side surface of the protrusion 401 a of the lens 401.

In addition, as depicted in the fourth example from top in FIG. 56 , thelight blocking film 521 may be formed in the area on the glass substrate12 extending to a predetermined height from the glass substrate 12 onthe side surface of the protrusion 401 a of the lens 401.

Furthermore, as depicted in the fifth example from top in FIG. 56 , thelight blocking film 521 may be formed only on the side surface of theprotrusion 401 a of the lens 401.

In addition, as depicted in the sixth example from top in FIG. 56 , thelight blocking film 521 may be formed in the area on the glass substrate12 extending to the highest position of the two side surfaces of thetwo-step side-surface lens 401.

Furthermore, as depicted in the seventh example from top in FIG. 56 ,the light blocking film 521 may be formed to cover the entire surfaceextending to the highest position of the two side surfaces of thetwo-step side-surface lens 401 on the glass substrate 12, and to coverthe outer circumferential portion of the solid-state imaging element 11.

In any of these examples, the light blocking film 521 is formed bypartial film formation, is formed by performing lithography after filmformation, is formed by performing film formation after a resist isformed, and lifting off the resist, or is formed by lithography.

In addition, a bank for forming a light blocking film at the outercircumferential section of the two-step side-surface lens 401 may beformed, and the light blocking film 521 may be formed at the outercircumferential section of the two-step side-surface lens 401 and on theinner side of the bank.

That is, as depicted on the uppermost row in FIG. 57 , a bank 531 havinga height identical to the lens height may be formed on the glasssubstrate 12 at the outer circumferential section of the two-stepside-surface lens 401, the light blocking film 521 may be formed bylithography or by coating at the outer circumferential section of thetwo-step side-surface lens 401, and on the inner side of the bank 531,and then the heights of the light blocking film 521, the lens 401, andthe bank 531 may be made flush by polishing such as CMP (ChemicalMechanical Polishing).

In addition, as depicted on the second row from top in FIG. 57 , thebank 531 having a height identical to the lens height may be formed onthe glass substrate 12 at the outer circumferential section of thetwo-step side-surface lens 401, simply a material of the light blockingfilm 521 is applied by coating at the outer circumferential section ofthe two-step side-surface lens 401, and on the inner side of the bank531, and the heights of the light blocking film 521, the lens 401, andthe bank 531 may self-align due to the material of the light blockingfilm 521.

Furthermore, as depicted on the third row from top in FIG. 57 , the bank531 having a height identical to the lens height may be formed on theglass substrate 12 at the outer circumferential section of the two-stepside-surface lens 401, and simply the light blocking film 521 may beformed by lithography at the outer circumferential section of thetwo-step side-surface lens 401, and on the inner side of the bank 531.

In addition, as depicted on the fourth row from top in FIG. 57 , thebank 531 may be formed on the glass substrate 12 at the outercircumferential section of the two-step side-surface lens 401 such thatthe bank 531 becomes connected with the boundary between the two-stepside-surface lens 401 and the glass substrate 12, the light blockingfilm 521 may be formed by lithography or by coating at the outercircumferential section of the two-step side-surface lens 401, and onthe inner side of the bank 531, and then the heights of the lightblocking film 521, the lens 401, and the bank 531 may be made flush bypolishing such as CMP (Chemical Mechanical Polishing).

In addition, as depicted on the fifth row from top in FIG. 57 , the bank531 may be formed on the glass substrate 12 at the outer circumferentialsection of the two-step side-surface lens 401 such that the bank 531becomes connected with the boundary between the two-step side-surfacelens 401 and the glass substrate 12, simply a material of the lightblocking film 521 is applied by coating at the outer circumferentialsection of the two-step side-surface lens 401, and on the inner side ofthe bank 531, and the heights of the light blocking film 521, the lens401, and the bank 531 may self-align due to the material of the lightblocking film 521.

Furthermore, as depicted on the sixth row from top in FIG. 57 , the bank531 may be formed on the glass substrate 12 at the outer circumferentialsection of the two-step side-surface lens 401 such that the bank 531becomes connected with the boundary between the two-step side-surfacelens 401 and the glass substrate 12, and simply the light blocking film521 may be formed by lithography at the outer circumferential section ofthe two-step side-surface lens 401, and on the inner side of the bank531.

In any of these examples, because the light blocking film is formed tocover the protrusion 401 a and side surface of the lens 401, it becomespossible to reduce occurrence of side surface flares.

Note that whereas the light blocking film is formed at the outercircumferential section of the lens 401 in the examples explained thusfar, for example, a light absorption film may be formed instead of thelight blocking film because it is sufficient if entrance of lightthrough the outer circumferential section of the lens 401 can beprevented.

22. Twenty-Second Embodiment

Whereas the lens 401 has a multi-step side surface in the examplesexplained thus far, the entire outer circumference of the lens 401 maynot have a multi-step configuration, and part of the outer circumferencemay not have a multi-step configuration.

That is, in the examples explained thus far, as represented by an areaZs in the left portion in FIG. 58 , the entire outer circumferentialsection including angled sections at the outer circumferential sectionof the lens 401 in addition to the longer sides and the shorter sideshas a multi-step configuration section 401 e including a multi-step sidesurface.

However, as represented by an area Zt in the right portion in FIG. 58 ,only part, such as angled sections, of the outer circumferential sectionof the lens 401 may have a non-multi-step configuration section 401 fnot including a multi-step configuration.

By adopting such a configuration, it becomes possible to enhance thereliability of the lens shape at the time of manufacturing of the lens401.

More specifically, for example, as depicted in the upper left portionand the lower left portion in FIG. 59 , a resin 409 g to be the rawmaterial of the lens 401 is placed on the glass substrate 12 in anuncured state, and, from above the resin 409, a shaping mold 551 ispressed downward from above in the figure as represented by a thickarrow in the upper left portion in FIG. 59 . As a result of suchoperation, the resin 409 g is pressed and expanded in directions of thinarrows in the upper left portion and the lower left portion in FIG. 59 ,and is shaped into the lens 401 like the one depicted in the upper rightportion and the lower right portion in FIG. 59 , and cured.

At this time, if the entire outer circumferential section of the lens401 is given a multi-step configuration, a convexity 551 a is formedover the entire outer circumferential section of the shaping mold 551.

By forming the convexity 551 a over the entire outer circumferentialsection of the shaping mold 551 in such a manner, the entire outercircumferential section is given the multi-step configuration section401 e, but, as depicted in the upper right portion and the lower rightportion in FIG. 59 , air stays in particular near angled sections at theconvexity 551 a of the shaping mold 551, remains as bubbles 561 in somecases, and has negative influence on the completed shape of the lens 401in some cases. Note that, in FIG. 59 , the lower left portion and thelower right portion in the figure are top views of the shaping mold 551,and the upper left portion and the upper right portion in the figure arecross-sectional views taken at positions corresponding to a broken lineAB in the lower left portion. Here, whereas the broken line AB is notdepicted in the lower right portion in FIG. 59 , the cross-sectionalview on the upper right portion in FIG. 59 is a cross-sectional viewtaken at positions in the lower right portion that are identical tothose corresponding to the broken line AB in the lower left portion.

In view of this, according to the present disclosure, as depicted in theupper portion and the lower portion in FIG. 60 , ventilation guides 551b are formed at part, such as angled sections, of the outercircumferential section of the shaping mold 551 such that theside-surface section does not have a multi-step configuration. Thereby,the non-multi-step configuration section 401 f not having a multi-stepconfiguration is formed at the part, such as angled sections, of theouter circumferential section of the lens 401, and the non-multi-stepconfiguration section 401 f reduces occurrence of the bubbles 561 at thetime of molding of the lens 401.

Note that, in FIG. 60 , the lower portion depicts a top view of theshaping mold 551, and the upper portion depicts a cross-section takenalong AB in the top view of the shaping mold 551.

By forming the ventilation guides 551 b in the shaping mold 551, andgiving part of the outer circumferential section of the lens 401 thenon-multi-step configuration section 401 f not having a multi-stepconfiguration, advantages like the ones mentioned below can be attained.

That is, as represented by a thick arrow in the upper portion in FIG. 61, when the shaping mold 551 is pressed downward from above in thefigure, and the lens 401 is formed, in a case where the convexity 551 ais formed over the entire outer circumferential section, angled sectionsof the lens 401 can also be shaped into the multi-step configurationsection 401 e, but gas confined at concavities formed on the inner sideof the convexity 551 a cannot be discharged, and remains as the bubbles561 in some cases.

However, according to the present disclosure, the ventilation guides 551b are formed. Thereby, as represented by a thick arrow in the lowerportion in FIG. 61 , when the shaping mold 551 is pressed from above inthe figure, and the lens 401 is formed, the non-multi-step configurationsection 401 f not having steps is formed at part of the outercircumferential section of the lens 401.

By providing the ventilation guides 551 b such that the non-multi-stepconfiguration section 401 f not having steps is formed at part of theouter circumferential section of the lens 401 in such a manner, itbecomes possible to discharge gas confined at the concavities formed onthe inner side of the convexity 551 a, and so it becomes possible toreduce occurrence of the bubbles 561 in the lens 401.

In addition, because the non-multi-step configuration section 401 f nothaving a multi-step side surface at the outer circumferential section ofthe lens 401 is part of the entire outer circumferential section of thelens 401 at which the ventilation guides 551 b are formed, it becomespossible to attain advantages of a multi-step side surface as the shapeof the lens 401.

Furthermore, as represented by a thick arrow in the upper portion inFIG. 62 , when the shaping mold 551 is peeled upward in the figure also,in a case where the convexity 551 a is formed over the entire outercircumferential section, and the multi-step configuration section 401 eis formed over the entire outer circumferential section of the lens 401,it becomes difficult to cause air to flow to the inner side of theconvexity 551 a, so peeling of the shaping mold 551 and the lens 401cannot be performed well, and there is a fear that the completed shapeof the lens 401 is influenced.

However, by forming the ventilation guides 551 b at part of the outercircumferential section, and forming the non-multi-step configurationsection 401 f at part of the outer circumferential section of the lens401, as depicted in the lower portion in FIG. 62 , it becomes possibleto cause air to flow to the concavities formed on the inner side of theconvexity 551 a through the ventilation guides 551 b and thenon-multi-step configuration section 401 f also when the shaping mold551 is peeled upward in the figure.

Thereby, it becomes possible to smoothly perform peeling of the shapingmold 551 and the lens 401, and it becomes possible to reduce influenceof the peeling of the shaping mold 551 on the completed shape of thelens 401.

<Width of Non-Multi-Step Configuration Section in Outer CircumferentialDirection>

In addition, by forming the non-multi-step configuration section 401 f,it becomes possible to enhance robustness of an AR coat against cracksdue to distortions relative to the lens 401 when the AR coat is formedon the effective region on the surface of the lens 401 or over theentire surface.

In particular, the larger the width of the non-multi-step configurationsection 401 f in the outer circumferential direction is, the higher therobustness of the AR coat against cracks due to distortions relative tothe lens 401.

Here, the robustness of an AR coat against cracks due to distortionsrelative to the lens 401 when the AR coat is formed on the effectiveregion of the surface or on the entire surface in each of cases asdepicted in the following order from left in FIG. 63 that an angledsection of the outer circumferential section of the lens 401 is themulti-step configuration section 401 e, that a non-multi-stepconfiguration section 401 f′ having a width d1 in the outercircumferential direction is formed, and that a non-multi-stepconfiguration section 401 f″ having a width d2 (>d1) in the outercircumferential direction is formed is compared with each other.

The robustness against cracks in a case where the AR coat is formed onthe effective region of the surface or over the entire surface is thehighest in the case of the non-multi-step configuration section 401 f″,is the next highest in the case of the non-multi-step configurationsection 401 f′, and is the lowest in the case of the multi-stepconfiguration section 401 e.

That is, it can be said that the larger the width of the non-multi-stepconfiguration section 401 f in the outer circumferential direction is,the higher the robustness of the AR coat against cracks due todistortions relative to the lens 401.

Accordingly, it can be said that in a case where the AR coat is formedon the lens 401, it is desirable if the non-multi-step configurationsection 401 f having a width in the outer circumferential directionaccording to required robustness is formed.

Application Examples of Twenty-Second Embodiment

Whereas the non-multi-step configuration section 401 f is provided atangled sections of the lens 401 as depicted in FIG. 64 in the exampleexplained thus far, the non-multi-step configuration section 401 f maybe formed at other positions as long as the positions are at the outercircumferential section of the lens 401.

For example, as depicted in FIG. 65 , the non-multi-step configurationsection 401 f may be formed near the center of each side of the outercircumferential section of the rectangular lens 401.

In addition, as depicted in FIG. 66 , the non-multi-step configurationsection 401 f may be formed at each angled section at the outercircumferential section of the rectangular lens 401, and near thecentral section of each side.

Furthermore, as depicted in FIG. 67 , the non-multi-step configurationsection 401 f may be formed at each angled section at the outercircumferential section of the rectangular lens 401, at five points onthe longer side sections, and at three points on the shorter sidesections, and the numbers of points where the non-multi-stepconfiguration section 401 f is formed on the longer side sections andthe shorter side sections may be other numbers.

In addition, the numbers of the non-multi-step configuration section 401f on the left side and the right side of the outer circumferentialsection of the lens 401 may be not equal, and advantages can be attainedas long as the non-multi-step configuration section 401 f is provided atleast at one point. Furthermore, intervals between the non-multi-stepconfiguration section 401 f may be constant intervals or may beinconstant intervals.

Note that when the lens 401 including the non-multi-step configurationsection 401 f like the ones depicted in FIGS. 64 to 67 is formed, theventilation guides 551 b need to be formed at positions, on the shapingmold 551, corresponding to the non-multi-step configuration section 401f.

23. Twenty-Third Embodiment

There has been a problem that portions near angled sections more easilypeel off in a case where the rectangular lens 131 is adhered or pastedonto the glass substrate 12 provided on the rectangular solid-stateimaging element 11.

To cope with such a problem, the effective region 131 a is set at thecentral section of the lens 131, the non-effective region 131 b is setat the outer circumferential section of the effective region 131 a, andfurthermore the effective region 131 a is given a size smaller than theouter circumferential size of the glass substrate 12 on the solid-stateimaging element 11 in the configuration explained in the fifteenthembodiment explained with reference to FIG. 23 .

In addition, it has been explained that because as the angles of angledsections of the rectangular lens 131 decrease, the angled sections peeloff from the glass substrate 12 more easily, it is possible to realize aconfiguration in which the angled sections do not peel off from theglass substrate 12 easily by adopting arc shapes as the shapes of angledsections of the lens 131″ as represented by the lens 131″ in the centralleft portion in FIG. 24 , and it is possible to reduce the risk ofoptically negative influence.

In view of this, as a twenty-third embodiment, furthermore, shapes thatare suitable in a case where angled sections of the lens 131″ are formedin arc shapes are explained below.

As depicted in FIG. 68 , assuming that the average value of a length Hnof the longer sides and a length Vn of the shorter sides of the lens131″ that is substantially rectangular when seen in a plan view is 5 to10 mm, peeling stresses applied to angled sections of the four cornersin a case where a radius R of the angled sections is gradually changedto larger radii were computed.

FIG. 69 is a graph depicting a relation between the radius R of angledsections of the four corners and peeling stresses applied to the angledsections.

As depicted in FIG. 69 , in a case where the radius R is smaller than 50μm, the peeling stress is approximately 60 Mpa, but by making the radiusR 100 μm, the peeling stress becomes 53 Mpa, and the peeling stress isimproved approximately by 10%. Furthermore, if the radius R is madeequal to or larger than 200 μm, the peeling stress becomes 50 Mpa, andthe peeling stress is improved approximately by 15%.

Accordingly, by making the radius R of angled sections of the fourcorners of the lens 131″ that is substantially rectangular when seen ina plan view equal to or larger than 100μ or further desirably equal toor larger than 200 μm, peeling stresses due to expansion or contractionof an AR coat at the time of implementation reflow heat load or at thetime of a reliability test can be reduced.

Whereas FIG. 69 depicts an example in the case of a lens size whoseaverage value of the length Hn of the longer sides and the length Vn ofthe shorter sides of the lens 131″ is 5 to 10 mm, an effective radius Rcan be defined generally for lens sizes.

Specifically, in a case where the length of each side of the lens 131″is within the range from 1 to 50 mm, by setting the radius R [μm] ofangled sections of the lens 131″ such that the ratio between the radiusR and the average side length AVE_LN={AVE (Hn+Vn)} [mm] of the lens 131″is higher than 1% ((R/AVE_LN)>1%), and desirably higher than 3%((R/AVE_LN)>3%), peeling stresses applied to the angled sections can bereduced.

With reference to FIG. 70 , a method of forming the lens 131″ havingfour corners whose angled sections are arc shapes is explained.

As depicted in A in FIG. 70 , after an ultraviolet light curing resin601 is dropped on the glass substrate 12 provided on the solid-stateimaging element 11, a shaping mold 602 having concave and convex shapesof the ultraviolet light curing resin 601 is pressed against theultraviolet light curing resin 601 at a predetermined speed and loadusing an alignment mark formed at predetermined positions as a referencemark. Then, by irradiating the ultraviolet light curing resin 601 withultraviolet light (UV light) from above in the figure for predeterminedtime, the lens 131″ is formed. Thereafter, when the shaping mold 602 isreleased, the lens 131″ is completed.

A light blocking film 603 is formed at the outer circumferential sectionof the backside (lower-surface side) of the shaping mold 602 such thatthe ultraviolet light curing resin 601 does not transmit light. Theultraviolet light curing resin 601 which has flowed out into theformation region of the light blocking film 603 is eliminated at acleaning step that follows.

B and C in FIG. 70 are plan views depicting the formation region of thelight blocking film 603 of the shaping mold 602.

There are the following two formation methods as methods for formingangled sections of the lens 131″ in arc shapes.

In a first formation method, as in B in FIG. 70 , angled sections of thefour corners of each of the lens plane shape of the shaping mold 602 andthe light blocking film 603 are formed to have right angles, and theultraviolet light curing resin 601 is cured by using an UV light sourcehaving a large directional angle (e.g. a directional angle larger than60°).

In a second formation method, as in C in FIG. 70 , angled sections ofthe four corners of each of the lens plane shape of the shaping mold 602and the light blocking film 603 are formed in arc shapes having adesired radius R, and the ultraviolet light curing resin 601 is cured byusing an UV light source having a small directional angle (e.g. adirectional angle smaller than 30°).

The first formation method causes larger shape variations as comparedwith the second formation method, and the inclination of a tapered shape(the tapered shapes in the second examples from left in FIG. 25 ) of theouter circumferential section as seen in a cross-sectional view, thatis, the inclination from the upper end section of the side surface ofthe lens 131″ toward the lower end section of the side surface,increases. Accordingly, it is necessary to ensure that there is anenough space between the outer circumferential section of the lens 131″and the outer circumferential section of the glass substrate 12.

In contrast to this, the second formation method is more suitablebecause the lens shape control reliability is high as compared with thefirst formation method.

Note that the radius R of an arc shape at each angled section of thelens 131″ can be made identical to the radii R of other angled sectionsin the four corners, and, other than this, as depicted in FIG. 71 , thearcs of the four corners can also be formed such that the arcs match onecircle 611 having a predetermined radius R.

In addition, the shapes of angled sections of the lens 131″ may becurves matching not only a circle, but part of an oval shape.

Furthermore, as depicted in FIG. 72 and FIG. 73 , angled sections of thefour corners of the lens 131″ can also be given polygonal shapes thatare configured by arranging a plurality of (two or more) obtuse angles(angles larger than 90°) at predetermined intervals.

FIG. 72 depicts an example in which angled sections of the lens 131″include polygonal shapes each including obtuse angles that are arrangedat two points at a predetermined interval.

FIG. 73 depicts an example in which angled sections of the lens 131″include polygonal shapes each including obtuse angles that are arrangedat six points at predetermined intervals.

According to the configuration of the twenty-third embodiment above, byforming angled sections of the four corners such that the angledsections do not have angles equal to or smaller than 90°, peelingstresses due to expansion or contraction of an AR coat at the time ofimplementation reflow heat load or at the time of a reliability test canbe reduced.

24. Examples of Application to Electronic Equipment

The imaging apparatus 1 in FIG. 1 , FIG. 4 , FIG. 6 to 17 , or the likementioned above can be applied to various types of electronic equipmentlike, for example, an imaging apparatus such as a digital still cameraor a digital video camera, a mobile phone having an imaging function, orother equipment having an imaging function.

FIG. 74 is a block diagram depicting a configuration example of animaging apparatus as electronic equipment to which the presenttechnology is applied.

An imaging apparatus 1001 depicted in FIG. 74 includes an optical system1002, a shutter apparatus 1003, a solid-state imaging element 1004, adrive circuit 1005, a signal processing circuit 1006, a monitor 1007,and a memory 1008, and is capable of capturing still images and movingimages.

The optical system 1002 includes one lens or a plurality of lenses,guides light from a subject (incident light) to the solid-state imagingelement 1004, and causes an image of the incident light to be formed onthe light reception surface of the solid-state imaging element 1004.

The shutter apparatus 1003 is arranged between the optical system 1002and the solid-state imaging element 1004, and controls a lightillumination period and a light blocking period of light to enter thesolid-state imaging element 1004 according to control of the drivecircuit 1005.

The solid-state imaging element 1004 includes a package including thesolid-state imaging element mentioned above. According to light an imageof which is formed on the light reception surface via the optical system1002 and the shutter apparatus 1003, the solid-state imaging element1004 accumulates signal charge for a predetermined period. The signalcharge accumulated in the solid-state imaging element 1004 istransferred according to a drive signal (timing signal) supplied fromthe drive circuit 1005.

The drive circuit 1005 outputs drive signals for controlling transferoperation of the solid-state imaging element 1004 and shutter operationof the shutter apparatus 1003, and drives the solid-state imagingelement 1004 and the shutter apparatus 1003.

The signal processing circuit 1006 performs various types of signalprocessing on the signal charge output from the solid-state imagingelement 1004. An image (image data) obtained by the signal processingcircuit 1006 performing the signal processing is supplied to anddisplayed on the monitor 1007, is supplied to and stored (recorded) onthe memory 1008, and so on.

In the thus-configured imaging apparatus 1001 also, by applying theimaging apparatus 1 in any of FIG. 1 , FIG. 9 , and FIGS. 11 to 22instead of the optical system 1002 and the solid-state imaging element1004 mentioned above, it becomes possible to reduce ghosts and flaresresulting from internal diffused reflection while a size reduction and aheight reduction of the apparatus configuration are realized.

25. Use Examples of Solid-State Imaging Apparatus

FIG. 75 is a figure depicting use examples in which the imagingapparatus 1 mentioned above is used.

The imaging apparatus 1 mentioned above can be used in various cases inwhich light such as visible light, infrared light, ultraviolet light, orX-rays is sensed in the following manner, for example.

-   -   Apparatuses, such as digital cameras or mobile equipment having        camera functions, that capture images aimed for watching and        viewing    -   Apparatuses aimed for transportation such as vehicle-mounted        sensors that capture images of a space in front of an        automobile, a space behind the automobile, spaces around the        automobile, the interior of the automobile or the like,        monitoring cameras that monitor travelling vehicles and roads or        distance measurement sensors that perform measurement of        distances between vehicles, and the like, for safe driving by        automatic stops or the like, recognition of the state of the        driver, and the like    -   Apparatuses aimed for home electric appliances such as TVs,        refrigerators, or air conditioners for performing equipment        operation according to gestures of a user captured by the        apparatuses    -   Apparatuses aimed for medical care or health care such as        endoscopes or apparatuses that perform imaging of blood vessels        by receiving infrared light    -   Apparatuses aimed for security such as monitoring cameras for        crime prevention uses or cameras for human identification uses    -   Apparatuses aimed for beauty care such as skin measurement        devices that capture images of skin or microscopes that capture        images of scalps    -   Apparatuses aimed for sports such as action cameras or wearable        cameras targeted at sports uses, or the like    -   Apparatuses aimed for agriculture such as cameras for monitoring        the states of fields and crops

26. Examples of Application to Endoscopic Surgery Systems

The technology according to the present disclosure (the presenttechnology) can be applied to various products. For example, thetechnology according to the present disclosure may be applied toendoscopic surgery systems.

FIG. 76 is a view depicting an example of a schematic configuration ofan endoscopic surgery system to which the technology according to anembodiment of the present disclosure (present technology) can beapplied.

In FIG. 76 , a state is illustrated in which a surgeon (medical doctor)11131 is using an endoscopic surgery system 11000 to perform surgery fora patient 11132 on a patient bed 11133. As depicted, the endoscopicsurgery system 11000 includes an endoscope 11100, other surgical tools11110 such as a pneumoperitoneum tube 11111 and an energy device 11112,a supporting arm apparatus 11120 which supports the endoscope 11100thereon, and a cart 11200 on which various apparatus for endoscopicsurgery are mounted.

The endoscope 11100 includes a lens barrel 11101 having a region of apredetermined length from a distal end thereof to be inserted into abody cavity of the patient 11132, and a camera head 11102 connected to aproximal end of the lens barrel 11101. In the example depicted, theendoscope 11100 is depicted which includes as a rigid endoscope havingthe lens barrel 11101 of the hard type. However, the endoscope 11100 mayotherwise be included as a flexible endoscope having the lens barrel11101 of the flexible type.

The lens barrel 11101 has, at a distal end thereof, an opening in whichan objective lens is fitted. A light source apparatus 11203 is connectedto the endoscope 11100 such that light generated by the light sourceapparatus 11203 is introduced to a distal end of the lens barrel 11101by a light guide extending in the inside of the lens barrel 11101 and isirradiated toward an observation target in a body cavity of the patient11132 through the objective lens. It is to be noted that the endoscope11100 may be a forward-viewing endoscope or may be an oblique-viewingendoscope or a side-viewing endoscope.

An optical system and an image pickup element are provided in the insideof the camera head 11102 such that reflected light (observation light)from the observation target is condensed on the image pickup element bythe optical system. The observation light is photo-electricallyconverted by the image pickup element to generate an electric signalcorresponding to the observation light, namely, an image signalcorresponding to an observation image. The image signal is transmittedas RAW data to a CCU 11201.

The CCU 11201 includes a central processing unit (CPU), a graphicsprocessing unit (GPU) or the like and integrally controls operation ofthe endoscope 11100 and a display apparatus 11202. Further, the CCU11201 receives an image signal from the camera head 11102 and performs,for the image signal, various image processes for displaying an imagebased on the image signal such as, for example, a development process(demosaic process).

The display apparatus 11202 displays thereon an image based on an imagesignal, for which the image processes have been performed by the CCU11201, under the control of the CCU 11201.

The light source apparatus 11203 includes a light source such as, forexample, a light emitting diode (LED) and supplies irradiation lightupon imaging of a surgical region to the endoscope 11100.

An inputting apparatus 11204 is an input interface for the endoscopicsurgery system 11000. A user can perform inputting of various kinds ofinformation or instruction inputting to the endoscopic surgery system11000 through the inputting apparatus 11204. For example, the user wouldinput an instruction or a like to change an image pickup condition (typeof irradiation light, magnification, focal distance or the like) by theendoscope 11100.

A treatment tool controlling apparatus 11205 controls driving of theenergy device 11112 for cautery or incision of a tissue, sealing of ablood vessel or the like. A pneumoperitoneum apparatus 11206 feeds gasinto a body cavity of the patient 11132 through the pneumoperitoneumtube 11111 to inflate the body cavity in order to secure the field ofview of the endoscope 11100 and secure the working space for thesurgeon. A recorder 11207 is an apparatus capable of recording variouskinds of information relating to surgery. A printer 11208 is anapparatus capable of printing various kinds of information relating tosurgery in various forms such as a text, an image or a graph.

It is to be noted that the light source apparatus 11203 which suppliesirradiation light when a surgical region is to be imaged to theendoscope 11100 may include a white light source which includes, forexample, an LED, a laser light source or a combination of them. Where awhite light source includes a combination of red, green, and blue (RGB)laser light sources, since the output intensity and the output timingcan be controlled with a high degree of accuracy for each color (eachwavelength), adjustment of the white balance of a picked up image can beperformed by the light source apparatus 11203. Further, in this case, iflaser beams from the respective RGB laser light sources are irradiatedtime-divisionally on an observation target and driving of the imagepickup elements of the camera head 11102 are controlled in synchronismwith the irradiation timings. Then images individually corresponding tothe R, G and B colors can be also picked up time-divisionally. Accordingto this method, a color image can be obtained even if color filters arenot provided for the image pickup element.

Further, the light source apparatus 11203 may be controlled such thatthe intensity of light to be outputted is changed for each predeterminedtime. By controlling driving of the image pickup element of the camerahead 11102 in synchronism with the timing of the change of the intensityof light to acquire images time-divisionally and synthesizing theimages, an image of a high dynamic range free from underexposed blockedup shadows and overexposed highlights can be created.

Further, the light source apparatus 11203 may be configured to supplylight of a predetermined wavelength band ready for special lightobservation. In special light observation, for example, by utilizing thewavelength dependency of absorption of light in a body tissue toirradiate light of a narrow band in comparison with irradiation lightupon ordinary observation (namely, white light), narrow band observation(narrow band imaging) of imaging a predetermined tissue such as a bloodvessel of a superficial portion of the mucous membrane or the like in ahigh contrast is performed. Alternatively, in special light observation,fluorescent observation for obtaining an image from fluorescent lightgenerated by irradiation of excitation light may be performed. Influorescent observation, it is possible to perform observation offluorescent light from a body tissue by irradiating excitation light onthe body tissue (autofluorescence observation) or to obtain afluorescent light image by locally injecting a reagent such asindocyanine green (ICG) into a body tissue and irradiating excitationlight corresponding to a fluorescent light wavelength of the reagentupon the body tissue. The light source apparatus 11203 can be configuredto supply such narrow-band light and/or excitation light suitable forspecial light observation as described above.

FIG. 77 is a block diagram depicting an example of a functionalconfiguration of the camera head 11102 and the CCU 11201 depicted inFIG. 76 .

The camera head 11102 includes a lens unit 11401, an image pickup unit11402, a driving unit 11403, a communication unit 11404 and a camerahead controlling unit 11405. The CCU 11201 includes a communication unit11411, an image processing unit 11412 and a control unit 11413. Thecamera head 11102 and the CCU 11201 are connected for communication toeach other by a transmission cable 11400.

The lens unit 11401 is an optical system, provided at a connectinglocation to the lens barrel 11101. Observation light taken in from adistal end of the lens barrel 11101 is guided to the camera head 11102and introduced into the lens unit 11401. The lens unit 11401 includes acombination of a plurality of lenses including a zoom lens and afocusing lens.

The number of image pickup elements which is included by the imagepickup unit 11402 may be one (single-plate type) or a plural number(multi-plate type). Where the image pickup unit 11402 is configured asthat of the multi-plate type, for example, image signals correspondingto respective R, G and B are generated by the image pickup elements, andthe image signals may be synthesized to obtain a color image. The imagepickup unit 11402 may also be configured so as to have a pair of imagepickup elements for acquiring respective image signals for the right eyeand the left eye ready for three dimensional (3D) display. If 3D displayis performed, then the depth of a living body tissue in a surgicalregion can be comprehended more accurately by the surgeon 11131. It isto be noted that, where the image pickup unit 11402 is configured asthat of stereoscopic type, a plurality of systems of lens units 11401are provided corresponding to the individual image pickup elements.

Further, the image pickup unit 11402 may not necessarily be provided onthe camera head 11102. For example, the image pickup unit 11402 may beprovided immediately behind the objective lens in the inside of the lensbarrel 11101.

The driving unit 11403 includes an actuator and moves the zoom lens andthe focusing lens of the lens unit 11401 by a predetermined distancealong an optical axis under the control of the camera head controllingunit 11405. Consequently, the magnification and the focal point of apicked up image by the image pickup unit 11402 can be adjusted suitably.

The communication unit 11404 includes a communication apparatus fortransmitting and receiving various kinds of information to and from theCCU 11201. The communication unit 11404 transmits an image signalacquired from the image pickup unit 11402 as RAW data to the CCU 11201through the transmission cable 11400.

In addition, the communication unit 11404 receives a control signal forcontrolling driving of the camera head 11102 from the CCU 11201 andsupplies the control signal to the camera head controlling unit 11405.The control signal includes information relating to image pickupconditions such as, for example, information that a frame rate of apicked up image is designated, information that an exposure value uponimage picking up is designated and/or information that a magnificationand a focal point of a picked up image are designated.

It is to be noted that the image pickup conditions such as the framerate, exposure value, magnification or focal point may be designated bythe user or may be set automatically by the control unit 11413 of theCCU 11201 on the basis of an acquired image signal. In the latter case,an auto exposure (AE) function, an auto focus (AF) function and an autowhite balance (AWB) function are incorporated in the endoscope 11100.

The camera head controlling unit 11405 controls driving of the camerahead 11102 on the basis of a control signal from the CCU 11201 receivedthrough the communication unit 11404.

The communication unit 11411 includes a communication apparatus fortransmitting and receiving various kinds of information to and from thecamera head 11102. The communication unit 11411 receives an image signaltransmitted thereto from the camera head 11102 through the transmissioncable 11400.

Further, the communication unit 11411 transmits a control signal forcontrolling driving of the camera head 11102 to the camera head 11102.The image signal and the control signal can be transmitted by electricalcommunication, optical communication or the like.

The image processing unit 11412 performs various image processes for animage signal in the form of RAW data transmitted thereto from the camerahead 11102.

The control unit 11413 performs various kinds of control relating toimage picking up of a surgical region or the like by the endoscope 11100and display of a picked up image obtained by image picking up of thesurgical region or the like. For example, the control unit 11413 createsa control signal for controlling driving of the camera head 11102.

Further, the control unit 11413 controls, on the basis of an imagesignal for which image processes have been performed by the imageprocessing unit 11412, the display apparatus 11202 to display a pickedup image in which the surgical region or the like is imaged. Thereupon,the control unit 11413 may recognize various objects in the picked upimage using various image recognition technologies. For example, thecontrol unit 11413 can recognize a surgical tool such as forceps, aparticular living body region, bleeding, mist when the energy device11112 is used and so forth by detecting the shape, color and so forth ofedges of objects included in a picked up image. The control unit 11413may cause, when it controls the display apparatus 11202 to display apicked up image, various kinds of surgery supporting information to bedisplayed in an overlapping manner with an image of the surgical regionusing a result of the recognition. Where surgery supporting informationis displayed in an overlapping manner and presented to the surgeon11131, the burden on the surgeon 11131 can be reduced and the surgeon11131 can proceed with the surgery with certainty.

The transmission cable 11400 which connects the camera head 11102 andthe CCU 11201 to each other is an electric signal cable ready forcommunication of an electric signal, an optical fiber ready for opticalcommunication or a composite cable ready for both of electrical andoptical communications.

Here, while, in the example depicted, communication is performed bywired communication using the transmission cable 11400, thecommunication between the camera head 11102 and the CCU 11201 may beperformed by wireless communication.

An example of endoscopic surgery systems to which the technologyaccording to the present disclosure can be applied has been explainedthus far. The technology according to the present disclosure can beapplied to, for example, the endoscope 11100, (the image pickup unit11402 of) the camera head 11102, (the image processing unit 11412 of)the CCU 11201, or the like in the configurations explained above.Specifically, for example, the imaging apparatus 1 in FIG. 1 , FIG. 9 ,FIG. 11 to 22, or the like can be applied to the lens unit 11401 and theimage pickup unit 10402. By applying the technology according to thepresent disclosure to the lens unit 11401 and the image pickup unit10402, it becomes possible to realize a size reduction and a heightreduction of the apparatus configuration, and also to reduce occurrenceof flares and ghosts resulting from internal diffused reflection.

Note that whereas an endoscopic surgery system has been explained as anexample here, the technology according to the present disclosure may beapplied to others such as a microscopic surgery system, for example.

27. Examples of Application to Mobile Bodies

The technology according to the present disclosure (the presenttechnology) can be applied to various products. For example, thetechnology according to the present disclosure may be realized as anapparatus to be mounted on a mobile body of a type such as anautomobile, an electric car, a hybrid electric car, a motorcycle, abicycle, a personal mobility, an airplane, a drone, a ship, or a robot.

FIG. 78 is a block diagram depicting an example of schematicconfiguration of a vehicle control system as an example of a mobile bodycontrol system to which the technology according to an embodiment of thepresent disclosure can be applied.

The vehicle control system 12000 includes a plurality of electroniccontrol units connected to each other via a communication network 12001.In the example depicted in FIG. 78 , the vehicle control system 12000includes a driving system control unit 12010, a body system control unit12020, an outside-vehicle information detecting unit 12030, anin-vehicle information detecting unit 12040, and an integrated controlunit 12050. In addition, a microcomputer 12051, a sound/image outputsection 12052, and a vehicle-mounted network interface (I/F) 12053 areillustrated as a functional configuration of the integrated control unit12050.

The driving system control unit 12010 controls the operation of devicesrelated to the driving system of the vehicle in accordance with variouskinds of programs. For example, the driving system control unit 12010functions as a control device for a driving force generating device forgenerating the driving force of the vehicle, such as an internalcombustion engine, a driving motor, or the like, a driving forcetransmitting mechanism for transmitting the driving force to wheels, asteering mechanism for adjusting the steering angle of the vehicle, abraking device for generating the braking force of the vehicle, and thelike.

The body system control unit 12020 controls the operation of variouskinds of devices provided to a vehicle body in accordance with variouskinds of programs. For example, the body system control unit 12020functions as a control device for a keyless entry system, a smart keysystem, a power window device, or various kinds of lamps such as aheadlamp, a backup lamp, a brake lamp, a turn signal, a fog lamp, or thelike. In this case, radio waves transmitted from a mobile device as analternative to a key or signals of various kinds of switches can beinput to the body system control unit 12020. The body system controlunit 12020 receives these input radio waves or signals, and controls adoor lock device, the power window device, the lamps, or the like of thevehicle.

The outside-vehicle information detecting unit 12030 detects informationabout the outside of the vehicle including the vehicle control system12000. For example, the outside-vehicle information detecting unit 12030is connected with an image pickup unit 12031. The outside-vehicleinformation detecting unit 12030 makes the image pickup unit 12031 imagean image of the outside of the vehicle, and receives the imaged image.On the basis of the received image, the outside-vehicle informationdetecting unit 12030 may perform processing of detecting an object suchas a human, a vehicle, an obstacle, a sign, a character on a roadsurface, or the like, or processing of detecting a distance thereto.

The image pickup unit 12031 is an optical sensor that receives light,and which outputs an electric signal corresponding to a received lightamount of the light. The image pickup unit 12031 can output the electricsignal as an image, or can output the electric signal as informationabout a measured distance. In addition, the light received by the imagepickup unit 12031 may be visible light, or may be invisible light suchas infrared rays or the like.

The in-vehicle information detecting unit 12040 detects informationabout the inside of the vehicle. The in-vehicle information detectingunit 12040 is, for example, connected with a driver state detectingsection 12041 that detects the state of a driver. The driver statedetecting section 12041, for example, includes a camera that images thedriver. On the basis of detection information input from the driverstate detecting section 12041, the in-vehicle information detecting unit12040 may calculate a degree of fatigue of the driver or a degree ofconcentration of the driver, or may determine whether the driver isdozing.

The microcomputer 12051 can calculate a control target value for thedriving force generating device, the steering mechanism, or the brakingdevice on the basis of the information about the inside or outside ofthe vehicle which information is obtained by the outside-vehicleinformation detecting unit 12030 or the in-vehicle information detectingunit 12040, and output a control command to the driving system controlunit 12010. For example, the microcomputer 12051 can perform cooperativecontrol intended to implement functions of an advanced driver assistancesystem (ADAS) which functions include collision avoidance or shockmitigation for the vehicle, following driving based on a followingdistance, vehicle speed maintaining driving, a warning of collision ofthe vehicle, a warning of deviation of the vehicle from a lane, or thelike.

In addition, the microcomputer 12051 can perform cooperative controlintended for automatic driving, which makes the vehicle to travelautonomously without depending on the operation of the driver, or thelike, by controlling the driving force generating device, the steeringmechanism, the braking device, or the like on the basis of theinformation about the outside or inside of the vehicle which informationis obtained by the outside-vehicle information detecting unit 12030 orthe in-vehicle information detecting unit 12040.

In addition, the microcomputer 12051 can output a control command to thebody system control unit 12020 on the basis of the information about theoutside of the vehicle which information is obtained by theoutside-vehicle information detecting unit 12030. For example, themicrocomputer 12051 can perform cooperative control intended to preventa glare by controlling the headlamp so as to change from a high beam toa low beam, for example, in accordance with the position of a precedingvehicle or an oncoming vehicle detected by the outside-vehicleinformation detecting unit 12030.

The sound/image output section 12052 transmits an output signal of atleast one of a sound and an image to an output device capable ofvisually or auditorily notifying information to an occupant of thevehicle or the outside of the vehicle. In the example of FIG. 78 , anaudio speaker 12061, a display section 12062, and an instrument panel12063 are illustrated as the output device. The display section 12062may, for example, include at least one of an on-board display and ahead-up display.

FIG. 79 is a diagram depicting an example of the installation positionof the image pickup unit 12031.

In FIG. 79 , the image pickup unit 12031 includes image pickup units12101, 12102, 12103, 12104, and 12105.

The image pickup units 12101, 12102, 12103, 12104, and 12105 are, forexample, disposed at positions on a front nose, sideview mirrors, a rearbumper, and a back door of the vehicle 12100 as well as a position on anupper portion of a windshield within the interior of the vehicle. Theimage pickup unit 12101 provided to the front nose and the image pickupunit 12105 provided to the upper portion of the windshield within theinterior of the vehicle obtain mainly an image of the front of thevehicle 12100. The image pickup units 12102 and 12103 provided to thesideview mirrors obtain mainly an image of the sides of the vehicle12100. The image pickup unit 12104 provided to the rear bumper or theback door obtains mainly an image of the rear of the vehicle 12100. Theimage pickup unit 12105 provided to the upper portion of the windshieldwithin the interior of the vehicle is used mainly to detect a precedingvehicle, a pedestrian, an obstacle, a signal, a traffic sign, a lane, orthe like.

Incidentally, FIG. 79 depicts an example of photographing ranges of theimage pickup units 12101 to 12104. An imaging range 12111 represents theimaging range of the image pickup unit 12101 provided to the front nose.Imaging ranges 12112 and 12113 respectively represent the imaging rangesof the image pickup units 12102 and 12103 provided to the sideviewmirrors. An imaging range 12114 represents the imaging range of theimage pickup unit 12104 provided to the rear bumper or the back door. Abird's-eye image of the vehicle 12100 as viewed from above is obtainedby superimposing image data imaged by the image pickup units 12101 to12104, for example.

At least one of the image pickup units 12101 to 12104 may have afunction of obtaining distance information. For example, at least one ofthe image pickup units 12101 to 12104 may be a stereo camera constitutedof a plurality of imaging elements, or may be an imaging element havingpixels for phase difference detection.

For example, the microcomputer 12051 can determine a distance to eachthree-dimensional object within the imaging ranges 12111 to 12114 and atemporal change in the distance (relative speed with respect to thevehicle 12100) on the basis of the distance information obtained fromthe image pickup units 12101 to 12104, and thereby extract, as apreceding vehicle, a nearest three-dimensional object in particular thatis present on a traveling path of the vehicle 12100 and which travels insubstantially the same direction as the vehicle 12100 at a predeterminedspeed (for example, equal to or more than 0 km/hour). Further, themicrocomputer 12051 can set a following distance to be maintained infront of a preceding vehicle in advance, and perform automatic brakecontrol (including following stop control), automatic accelerationcontrol (including following start control), or the like. It is thuspossible to perform cooperative control intended for automatic drivingthat makes the vehicle travel autonomously without depending on theoperation of the driver or the like.

For example, the microcomputer 12051 can classify three-dimensionalobject data on three-dimensional objects into three-dimensional objectdata of a two-wheeled vehicle, a standard-sized vehicle, a large-sizedvehicle, a pedestrian, a utility pole, and other three-dimensionalobjects on the basis of the distance information obtained from the imagepickup units 12101 to 12104, extract the classified three-dimensionalobject data, and use the extracted three-dimensional object data forautomatic avoidance of an obstacle. For example, the microcomputer 12051identifies obstacles around the vehicle 12100 as obstacles that thedriver of the vehicle 12100 can recognize visually and obstacles thatare difficult for the driver of the vehicle 12100 to recognize visually.Then, the microcomputer 12051 determines a collision risk indicating arisk of collision with each obstacle. In a situation in which thecollision risk is equal to or higher than a set value and there is thusa possibility of collision, the microcomputer 12051 outputs a warning tothe driver via the audio speaker 12061 or the display section 12062, andperforms forced deceleration or avoidance steering via the drivingsystem control unit 12010. The microcomputer 12051 can thereby assist indriving to avoid collision.

At least one of the image pickup units 12101 to 12104 may be an infraredcamera that detects infrared rays. The microcomputer 12051 can, forexample, recognize a pedestrian by determining whether or not there is apedestrian in imaged images of the image pickup units 12101 to 12104.Such recognition of a pedestrian is, for example, performed by aprocedure of extracting characteristic points in the imaged images ofthe image pickup units 12101 to 12104 as infrared cameras and aprocedure of determining whether or not it is the pedestrian byperforming pattern matching processing on a series of characteristicpoints representing the contour of the object. When the microcomputer12051 determines that there is a pedestrian in the imaged images of theimage pickup units 12101 to 12104, and thus recognizes the pedestrian,the sound/image output section 12052 controls the display section 12062so that a square contour line for emphasis is displayed so as to besuperimposed on the recognized pedestrian. The sound/image outputsection 12052 may also control the display section 12062 so that an iconor the like representing the pedestrian is displayed at a desiredposition.

An example of vehicle control systems to which the technology accordingto the present disclosure can be applied has been explained thus far.The technology according to the present disclosure can be applied to theimage pickup unit 12031, for example, in the configurations explainedabove. Specifically, for example, the imaging apparatus 1 in FIG. 1 ,FIG. 9 , FIG. 11 to 22 , or the like can be applied to the image pickupunit 12031. By applying the technology according to the presentdisclosure to the image pickup unit 12031, it becomes possible torealize a size reduction and a height reduction of the apparatusconfiguration, and also to reduce occurrence of flares and ghostsresulting from internal diffused reflection.

Note that the present disclosure can have the following configurations.

(1)

An Imaging Apparatus Including:

a solid-state imaging element that generates a pixel signal byphotoelectric conversion according to a light amount of incident light;

a glass substrate provided on the solid-state imaging element; and

a lens provided on the glass substrate, in which

four corners of the lens that is substantially rectangular when seen ina plan view do not have angles equal to or smaller than 90°.

(2)

The imaging apparatus according to (1), in which the four corners of thelens have an arc shape with a predetermined radius.

(3)

The imaging apparatus according to (2), in which the predeterminedradius is a radius that satisfies {(the predetermined radius)/(anaverage value of lengths of longer sides and shorter sides of thelens)}>1%.

(4)

The imaging apparatus according to (3), in which the predeterminedradius is a radius that satisfies {(the predetermined radius)/(anaverage value of lengths of longer sides and shorter sides of thelens)}>3%.

(5)

The imaging apparatus according to (3) or (4), in which a length of eachside of the lens is within a range from 1 to 50 mm.

(6)

The imaging apparatus according to (2), in which the predeterminedradius is equal to or larger than 100 μm.

(7)

The imaging apparatus according to (6), in which the predeterminedradius is equal to or larger than 200 μm.

(8)

The imaging apparatus according to (6) or (7), in which an average valueof lengths of longer sides and shorter sides of the lens is within arange from 5 to 10 mm.

(9)

The imaging apparatus according to (2), in which arcs of the fourcorners of the lens match one circle having the predetermined radius.

(10)

The imaging apparatus according to (1), in which angled sections of thefour corners of the lens have polygonal shapes that include a pluralityof obtuse angles that are arranged at predetermined intervals.

(11)

Electronic Equipment Including:

an imaging apparatus including

-   -   a solid-state imaging element that generates a pixel signal by        photoelectric conversion according to a light amount of incident        light,    -   a glass substrate provided on the solid-state imaging element,        and    -   a lens provided on the glass substrate,    -   four corners of the lens that is substantially rectangular when        seen in a plan view not having angles equal to or smaller than        90°.

REFERENCE SIGNS LIST

-   -   1: Imaging apparatus    -   10: Integrated configuration section    -   11: Solid-state imaging element (having CPS structure)    -   11 a: Lower substrate (logic board)    -   11 b: Upper substrate (pixel sensor substrate)    -   11 c: Color filter    -   11 d: On-chip lens    -   12: Glass substrate    -   13: Adhesive    -   14: IRCF (infrared cut filter)    -   14′: IRCF glass substrate    -   15: Adhesive    -   16: Lens group    -   131, 131′, 131″: Lens    -   151: Adhesive    -   171: Lens group    -   191: Solid-state imaging element (having COB structure)    -   271: Lens    -   271 a: AR coat    -   291: Lens    -   291 a: Anti-reflection treatment section    -   301: Infrared cut lens    -   321: Glass substrate    -   351: Refractive film    -   452, 452′, 452″, 452′″: Shaping mold    -   453: Light blocking film    -   461: Ultraviolet light curing resin    -   601: Ultraviolet light curing resin    -   602: Shaping mold    -   603: Light blocking film    -   611: Circle

1. An imaging apparatus comprising: a solid-state imaging element thatgenerates a pixel signal by photoelectric conversion according to alight amount of incident light; a glass substrate provided on thesolid-state imaging element; and a lens provided on the glass substrate,wherein four corners of the lens that is substantially rectangular whenseen in a plan view do not have angles equal to or smaller than 90°. 2.The imaging apparatus according to claim 1, wherein the four corners ofthe lens have an arc shape with a predetermined radius.
 3. The imagingapparatus according to claim 2, wherein the predetermined radius is aradius that satisfies {(the predetermined radius)/(an average value oflengths of longer sides and shorter sides of the lens)}>1%.
 4. Theimaging apparatus according to claim 3, wherein the predetermined radiusis a radius that satisfies {(the predetermined radius)/(an average valueof lengths of longer sides and shorter sides of the lens)}>3%.
 5. Theimaging apparatus according to claim 3, wherein a length of each side ofthe lens is within a range from 1 to 50 mm.
 6. The imaging apparatusaccording to claim 2, wherein the predetermined radius is equal to orlarger than 100 μm.
 7. The imaging apparatus according to claim 6,wherein the predetermined radius is equal to or larger than 200 μm. 8.The imaging apparatus according to claim 6, wherein an average value oflengths of longer sides and shorter sides of the lens is within a rangefrom 5 to 10 mm.
 9. The imaging apparatus according to claim 2, whereinarcs of the four corners of the lens match one circle having thepredetermined radius.
 10. The imaging apparatus according to claim 1,wherein angled sections of the four corners of the lens have polygonalshapes that include a plurality of obtuse angles that are arranged atpredetermined intervals.
 11. Electronic equipment comprising: an imagingapparatus including a solid-state imaging element that generates a pixelsignal by photoelectric conversion according to a light amount ofincident light, a glass substrate provided on the solid-state imagingelement, and a lens provided on the glass substrate, four corners of thelens that is substantially rectangular when seen in a plan view nothaving angles equal to or smaller than 90°.